In this study, we synthesized a new Al 16.6 Cu 16.6 Fe 16.6 Mn 16.6 Mg 16.6 Ti 16.6 lightweight high entropy alloy (LWHEA) by high energy ball milling and spark plasma sintering (SPS). The effect of milling time (15, 30, 45, and 60 h) and SPS conditions (600 and 700 °C) on microstructure, hardness, and density of LWHEAs were studied. The results showed that milled LWHEA is base centered cubic (BCC) structured, consisting of dual BCC1/BCC2 matrix with dispersed minor Cu 2 Mg precipitates and Ti. After SPS of milled samples, the BCC2 phase fraction was increased gradually. The distribution of Ti was uniform up to 45 h milled sample SPSed at 600 °C. However, porosity was built up beyond 45 h milling and higher SPS temperature (700 °C). The presence of finer secondary phases in the HEA matrix contributes to the dispersion hardening. The optimum microhardness and density of LWHEA AlCuFeMnMgTi were around 770 HV and 4.34 g cm − 3 which is superior to other conventional alloys such as Al or Ti-based alloys.

Novel AlCuFeMnTi-X high-entropy alloy (HEA) powder mixture with individual X = Mg, Si, Zn was mechanically alloyed for 45 h and consolidated at 700°C by spark plasma sintering (SPS). The effect of the addition of Mg, Si and Zn was studied on the microstructural evolution, density and microhardness of the developed HEAs. The results demonstrated that milled HEAs were body-centered cubic (BCC) structured (BCC1 and BCC2). The BCC2 fraction was highest in AlCuFeMnTi-Zn followed by AlCuFeMnTi-Si. However, minor Ti, Si and intermetallic compounds (IMC) were observed in AlCuFeMnTi-Mg with BCC1 major phase. After SPS, the alloying improved, and BCC2-rich HEAs were observed for all compositions. An attractive hardness value was obtained in AlCuFeMnTi-Mg due to the dispersed Cu 2 Mg precipitates in the BCC2/BCC1 matrix followed by AlCuFeMnTi-Si and AlCuFeMnTi-Zn HEA, respectively.

In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy. We ball-milled the constituent Sn and Cu powders in eutectic composition for 45 h. The microstructural studies were carried out using optical and scanning electron microscopy. The melting behavior of the powder was examined using differential scanning calorimetry (DSC). We observed a considerable depression in the melting point of the Sn-0.7Cu alloy (≈7 °C) as compared to standard cast Sn-0.7Cu alloys. The resultant crystallite size and lattice strain of the ball-milled Sn-0.7Cu alloy were 76 nm and 1.87%, respectively. The solderability of the Sn-0.7Cu alloy was also improved with the milling time, due to the basic processes occurring during the HEBM.