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Copper is widely used because it is inexpensive, abundant, and highly conductive. However, most copper used in industrial coating processes is in the form of circular powder, which is problematic for large area, high conductive coatings. In this work, 2D single-crystalline Cu nanoplates (Cu NPLs) were synthesized and a systematic study on coating with large-scale Cu NPLs using a Meyer-rod coating process was performed. The rheological behaviors of the Cu solution with various concentrations, surface tensions, and speeds were analyzed using Ca and Re numbers to optimize coating conditions. In addition, the effect of intensive pulse light (IPL) to sinter the coper film within a 1 s timeframe was also investigated in order to be able to produce an electrode in the shortest possible time which is applicable to industry. Finally, the Meyer-rod coated electrode was utilized in an electrochemical luminescence (ECL) device.