A new, substituted 2-[( E) -{[4-(benzyloxy)phenyl]imino} methyl]-4-[( E) -(4-nitrophenyl)diazenyl]phenol azoazomethine ligand (mbH) was synthesized from 2-hydroxy-5-[(4-nitrophenyl)diazenyl]benzaldehyde and 4-benzyloxyanilinehydrochloride in ethyl alcohol solution. These mononuclear Mn(II), Co(II), Ni(II), Cu(II), and Zn(II) complexes ofthe ligand were prepared and their structures were proposed by elemental analysis, and infrared and ultraviolet-visible spectroscopy; the proton NMR spectrum of the mbH ligand was also recorded. The azo-azomethine ligand, mbH, behaves as a bidentate ligand coordinating through the nitrogen atom of the azomethine (-CH=N-) and the oxygen atom of the phenolic group. Elemental analyses indicated that the metal:ligand ratio was 1:2 in the metal chelates. Powder X-ray diffraction parameters suggested a monoclinic system for the mbH ligand and its Ni(II), Cu(II), Co(II), and Zn(II) complexes, and an orthorhombic system for the Mn(II) complex. Electrochemical properties of the ligand and its metal complexes were investigated in 1 × 10 −3 -1 × 10 −4 M DMF and CH 3 CN solvent in the range 200, 250, and 500 mV s −1 scan rates. The ligand showed both reversible and irreversible processes at these scan rates. In addition, genotoxic properties of the ligand and its complexes were examined.
Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated a two-layer, submicrometer-scale overlap junction fabrication process suitable for qubits with long coherence times. Here, we extend the overlap junction fabrication process to micrometer-scale junctions. This allows us to fabricate other superconducting quantum devices. For example, we demonstrate an overlap junction-based Josephson parametric amplifier that uses only two layers. This efficient fabrication process yields frequency-tunable devices with negligible insertion loss, a gain of ∼30 dB, and quantum limited noise performance. Compared to other processes, the overlap junction allows for fabrication with minimal infrastructure, high yield, and state-of-the-art device performance.
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