Temperature-dependent characteristics of GeSn light-emitting diodes with Sn composition up to 9.2% have been systematically studied. Such diodes were based on Ge/GeSn/Ge double heterostructures (DHS) that were grown directly on a Si substrate via a chemical vapor deposition system. Both photoluminescence and electroluminescence spectra have been characterized at temperatures from 300 to 77 K. Based on our theoretical calculation, all GeSn alloys in this study are indirect bandgap materials. However, due to the small energy separation between direct and indirect bandgap, and the fact that radiative recombination rate greater than non-radiative, the emissions are mainly from the direct Γ-valley to valence band transitions. The electroluminescence emissions under current injection levels from 102 to 357 A/cm2 were investigated at 300 K. The monotonic increase of the integrated electroluminescence intensity was observed for each sample. Moreover, the electronic band structures of the DHS were discussed. Despite the indirect GeSn bandgap owing to the compressive strain, type-I band alignment was achieved with the barrier heights ranging from 11 to 47 meV.
Optical properties of germanium tin (Ge 1Àx Sn x ) alloys have been comprehensively studied with Sn compositions from 0 (Ge) to 12%. Raman spectra of the GeSn samples with various Sn compositions were measured. The room temperature photoluminescence (PL) spectra show a gradual shift of emission peaks towards longer wavelength as Sn composition increases. Temperature dependent PL shows the PL intensity variation along with the temperature change, which reveals the indirectness or directness of the bandgap of the material. As temperature decreases, the PL intensity decreases with Sn composition less than 8%, indicating the indirect bandgap Ge 1Àx Sn x ; while the PL intensity increases with Sn composition higher than 10%, implying the direct bandgap Ge 1Àx Sn x . Moreover, the PL study of n-doped samples shows bandgap narrowing compared to the unintentionally (Boron) doped thin film with similar Sn compositions due to the doping.
Germanium-tin alloys were grown directly on Si substrate at low temperatures using a coldwall ultra-high vacuum chemical-vapor-deposition system. Epitaxial growth was achieved by adopting commercial gas precursors of germane and stannic chloride without any carrier gases. The X-ray diffraction analysis showed the incorporation of Sn and that the Ge 1−x Sn x films are fully epitaxial and strain relaxed. Tin incorporation in the Ge matrix was found to vary from 1 to 7%. The scanning electron microscopy images and energy-dispersive X-ray spectra maps show uniform Sn incorporation and continuous film growth. Investigation of deposition parameters shows that at high flow rates of stannic chloride the films were etched due to the production of HCl. The photoluminescence study shows the reduction of band-gap from 0.8 to 0.55 eV as a result of Sn incorporation.
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