Chitosan is a natural polysaccharide derived from chitin which is found in the fungus cell walls and crustacean shells. Chitosan has generated a great interest in piezoelectric application because of its interesting properties such as biodegradability, biocompatibility, and low toxicity. The purpose of this study is to focus on the cultivation, fabrication and characterization of chitosan thin film from fungal strain, Aspergillus oryzae cell walls. The fungi was cultivated in bioreactor. Fabrication of chitosan thin film via solvent casting method was optimized via one-factor-at-a-time (OFAT) with 2 parameters (drop-casting volume of solution and drying temperature). Pure chitosan dissolved in formic acid at 0.25 M concentration, dried at 60°C with 35 mL of solution volume gave the highest mechanical quality factor (3.22) and the lowest dissipation factor (0.327) for thin film fabrication. The optimized fabricate thin film was validated using fungal chitosan and shows the results of mechanical quality factor (3.68) and dissipation factor (0.248) which is comparable to conventional piezopolymer thin film. Therefore, fungal chitosan thin film obtained in this study has the potential to be used in piezoelectric application.
In this study, chitosan thin film derived from Aspergillus oryzae cell walls was fabricated and characterised. First, the chitosan from the fungal biomass was extracted (0.18 g/g) with 52.25% of degree of deacetylation obtained through Fourier transform infrared (FTIR) spectroscopy. Subsequently, several parameters of the chitosan thin film fabrication were optimised, including chitosan solution volume and drying temperature. Resultantly, the highest mechanical quality factor (3.22±0.012), the lowest dissipation factor (0.327±0.0003) and the best tensile strength (13.35±0.045 MPa) were obtained when pure chitosan was dissolved in 35 ml of 0.25 M formic acid and dried at 60 ˚C. In addition, the scanning electron microscopy (SEM) analysis presented a fine chitosan agglomerate distributed in the formic acid. The optimised fabricated, fungal-derived chitosan thin film was validated, recording a mechanical quality factor of 3.68 and dissipation factor of 0.248; both values were comparable to the synthetic polymer, polyvinylidene fluoride (PVDF) thin film. Thus, fungal-derived chitosan thin film can potentially be used as a piezoelectric material.
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