Ultrasonic additive manufacturing (UAM) is a novel solid-state freeform fabrication process that utilizes ultrasonic energy to merge similar/dissimilar metal tapes. Metallurgical bonding between the metal tapes can be achieved instantaneously once the sonotrode rotates through. Herein, five-layered Al-1100 ultrasonically consolidated samples are fabricated under various parameter combinations of ultrasonic amplitude and normal force settings. The microstructure and texture evolution of the built component among layers are characterized using electron backscattered diffraction (EBSD). The results reveal that among the upper layers, recrystallization only occurs at very local interface regions due to the local shear deformation, while the bulk region of each layer still remains the starting microstructure unaffected. However, after this cyclic accumulating process, dynamic recovery (DRV) and dynamic recrystallization (DRX) are observed to take place in the bottom of the built samples. The evolution of microstructures and textures of the bottom layer is a function of input energy, which well explains the effect of ultrasonic energy on the microstructure evolution at the metallurgical bonding regions.
Ultrasonic additive manufacturing (UAM) is an advanced additive manufacturing technique that utilizes ultrasonic energy to rapidly joining thin metal tapes into solid parts in a layer accumulating manner. In this study, the effects of processing parameters on the bond properties of UAM samples were investigated via peel tests, linear weld density (LWD) measurements, microhardness tests and EBSD. The results reveal that, in terms of the overall tendency, the peeling strength and LWD increase with the increasing amplitude and normal force settings. However, a parameter threshold phenomenon and two different mechanisms that affect the bond properties were also observed. Furthermore, the microstructure evolution results show that the development of the interface is closely related to the applied parameters, which can also well explain the bond property variations and the parameter threshold phenomenon.
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