No abstract

This study investigates the influence of adding Sb on the microstructure and adhesive strength of the Sn3.5Ag solder. Both solidus and liquidus temperatures increase as Sb additions increase. Adding 1.5wt.%Sb leads to the narrowest range (6.6°C) between the solidus and liquidus temperature of the solder. Adding Sb decomposes the as-soldered ringlike microstructure of Sn3.5Ag and causes solid-solution hardening. The as-soldered hardness increases with increasing Sb addition. For long-term storage, adding Sb reduces the size of the rodlike Ag 3 Sn compounds. The hardness also increases with increasing Sb addition. Adding Sb depresses the growth rate of interfacial intermetallic compounds (IMCs) layers, but the difference between 1% and 2% Sb is not distinct. For mechanical concern, adding Sb improves both adhesive strength and thermal resistance of Sn3.5Ag, where 1.5% Sb has the best result. However, adding Sb causes a variation in adhesive strength during thermal storage. The more Sb is added, the higher the variation reveals, and the shorter the storage time requires. This strength variation helps the solder joints to resist thermal storage.

Reactions of Fe(CN)(5)L(3-) (L = 4-aminopyridine (4-ampy), pyridine (py), 4,4'-bipyridine (4,4'-bpy), and pyrazine (pz)) with peroxydisulfate, Fe(CN)(5)L(3-) + S(2)O(8)(2-) right harpoon over left harpoon Fe(CN)(5)L(2-) + SO(4)(-) + SO(4)(2-), have been found to follow an outer-sphere electron transfer mechanism. The specific rate constants of oxidation are 1.45 +/- 0.01, (9.00 +/- 0.02) x 10(-2), (5.60 +/- 0.01) x 10(-2), and (2.89 +/- 0.01) x 10(-2) M(-1) s(-1), for L = 4-ampy, py, 4,4'-bpy, and pz, respectively, at &mgr; = 0.50 M LiClO(4), T = 25 degrees C, pH = 4.4-8.8. The rate constants of oxidation for the corresponding Ru(NH(3))(5)L(2+) complexes were also measured and were found to be faster than those of Fe(CN)(5)L(3-) complexes by a factor of approximately 10(2) even after the corrections for the differences in reduction potentials and in the charges of the complexes. The difference in reactivity may arise from the hydrogen bonding between peroxydisulfate and the ammonia ligands of Ru(NH(3))(5)L(2+) and nonadiabaticity observed in the Fe(CN)(5)L(3-) complexes.

CuInSe2 (CIS) powders were synthesized using CuSe, Cu2Se, and In2Se3 as the raw materials. The formation mechanisms and reaction kinetics from CuSe/In2Se3 and Cu2Se/In2Se3 powders in a selenium atmosphere were investigated. It was observed that the formation temperature of α‐CIS powders synthesized using Cu2Se/In2Se3 as the raw materials was higher than that using CuSe/In2Se3. Both reactions for Cu2Se/In2Se3 and CuSe/In2Se3 mixtures follow one‐dimensional diffusion‐controlled reactions with apparent activation energies of 124.3 and 73.2 kJ/mol, respectively. For both mixtures the indium‐rich β‐CIS phase resulting from Cu+ ion diffusion toward the In2Se3 phase was observed. The particle size and morphology of the newly formed CIS was similar to In2Se3, which indicated that the CIS formation kinetics may be dominated by the diffusion of Cu+ ions. The Cu–Se liquid phase resulting from the peritectic decomposition of CuSe2 and CuSe at a relatively low temperature may promote Cu+ diffusion into the In2Se3 surface, assisting CIS formation.

Applications of optical fiber sensors on the structural health monitoring of the deformations of bridges, viaduct of high speed rail systems, railway tracks, airport pavements, and geological faults are introduced.