Through the latest technological and conceptual developments, the centralized cloud-computing approach has moved to structures such as edge, fog, and the Internet of Things (IoT), approaching end users. As mobile network operators (MNOs) implement the new 5G standards, enterprise computing function shifts to the edge. In parallel to interconnection topics, there is the issue of global impact over the environment. The idea is to develop IoT devices to eliminate the greenhouse effect of current applications. Radio-frequency identification (RFID) is the technology that has this potential, and it can be used in applications ranging from identifying a person to granting access in a building. Past studies have focused on how to improve RFID communication or to achieve maximal throughput. However, for many applications, system latency and availability are critical aspects. This paper examines, through stochastic Petri nets (SPNs), the availability, dependability, and latency of an object-identification system that uses RFID tags. Through the performed analysis, the optimal balance between latency and throughput was identified. Analyzing multiple communication scenarios revealed the availability of such a system when deployed at the edge layer.
When it comes to transmission lines the common causes for signal integrity (SI) problems are the mismatches caused during the routing process. From all the possible causes for mismatches, vias are the most common ones. In the literature, different approaches are proposed to resolve the SI problems caused by vias: stitching vias, matching the driver output impedance to the transmission line's new value [1]. Stitching vias can be used when printed circuit boards (PCBs) are used with more than four layers. Additionally a smaller value for the seriesmatching resistor improves the signal rise/fall time, but also increases the ringing effect's amplitude. In the paper, a solution for improving the signal at the receiver is proposed that can be used even on four layer PCB. The proposed solution keeps the improvements obtained through matching the driver output to the transmission line's modified impedance, without increasing the ringing effect amplitude.
There are studies which show the effect of capacitive discontinuity on the integrity of a signal transmitted in a trace on a PCB. This kind of discontinuity that can appear in path of the signal to the load are inevitable, because a trace it has at least two corners, sometimes two vias, an occasionally a width change. The presence of this capacitive discontinuity can be treated as a lump capacitor that appears in the path of the signal. We tried to find out where to place via or to make a corner on a trace so the signal would be less affected by this kind of discontinuity.
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