The effect of nanoclay on various material properties like damping and strength of typical thermoset polymers, such as epoxy and vinyl ester, was investigated. Different environmental conditions typical for high-voltage transmission pylons made of composite materials were taken into account. Resin samples were prepared with various clay weight fractions ranging from 0% to 3%. Scanning electron microscopy, transmission electron microscopy, X-ray diffraction and rheological analysis were used to study the morphology and the structure of the nanocomposites. For all nanoclay-modified thermoset polymers, the morphology was found to be of exfoliated structure mainly. Static, uniaxial tensile tests showed that the addition of nanoclay to thermoset polymers led to a beneficial effect on the stiffness, whereas the tensile strength and ductility significantly decreased. When exposed to different environmental conditions, nanoclay was found to have a positive influence on the dynamic properties, analysed by a dynamic mechanical thermal analysis. The addition of nanoclay to the thermoset resin led to an increase of the damping properties by up to 28% for vinyl ester and up to 6% for epoxy at 220°C. The dielectric properties were evaluated by electrical breakdown strength tests resulting in 11% better insulating behaviour for nanoclay-modified vinyl ester.
The use of integrated structural health monitoring systems for critical composite parts, such as wind turbine blades, fuselage and wing parts, is an promising approach to guarantee a safe and efficient operational lifetime of such components. Therefore, the integration of thick functional components like sensors, actuators and electronic components is often necessary. An optimal integration of such components should be ensured without material imperfections in the composite structure, i.e. voids and resin rich areas, and failure of the functional components. In this paper, first investigations were undertaken for a basic understanding of the mechanical performance of a fibre reinforced plastic component with integrated functional elements. The influence of different materials and treatment methods for the encapsulation of electronic components was experimentally investigated under static and dynamic loading tests. By means of a parametric finite element model, the effects of an encapsulation and various parameters such as the shape and orientation of the electronic components were examined. Several encapsulation variants were investigated in order to minimise the chance of failure initiations. Based both on experimental and numerical results, a preferred composite integration concept was selected for an electronic board and some first recommendations for an optimal integration were derived.
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