The thermal resistances of 1250 kinds of interface were computed at room temperature based on the phonon diffuse mismatch model. The result shows that the ratio of Debye temperature and the ratio of average sound velocity can be approximately used to characterize the difference of two materials in terms of interfacial thermal resistance. The high interfacial thermal resistances are composed of high and low Debye temperature materials. The low interfacial thermal resistances are composed of both similar Debye temperature materials, and their Debye temperatures are very high. The relation between the interfacial thermal resistance with the ratio of average sound velocity is similar to that of the ratio of Debye temperature.

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We analyze the Seebeck coefficients of a magnetic semiconductor CuFeS2 using first-principles calculation methods based on density functional theory. The calculated temperature dependence of the Seebeck coefficient in the antiferromagnetic phase reproduces a distinctive behavior in a bulk CuFeS2, such as a peak structure at a low temperature and weak temperature dependence around room temperature. In doped systems, almost linear temperature dependence appears. Despite not including any effect beyond the conventional spin density functional theory in our calculations, the calculated results agree qualitatively with the experimental results. These agreements indicate that the behavior of the Seebeck coefficients in CuFeS2 is mainly determined by its electronic structure.