A dismantlable adhesion system satisfies both a strong bonding strength during use and a quick debonding process on demand in response to an external stimulus as a trigger for dismantling. In this study, we synthesized acrylate copolymers consisting of 2-( tert -butoxycarbonyloxy)ethyl acrylate (BHEA), 2-ethylhexyl acrylate (2EHA), and 2-hydroxyethyl acrylate (HEA) as the repeating units and evaluated the properties as dismantlable adhesives. First, the thermal degradation behavior of the obtained polymers was investigated by thermogravimetric analysis and IR spectroscopy. The BHEA-containing polymers were thermally stable during heating at a temperature below 150 °C, but they rapidly degraded, i.e., the deprotection of the tert -butoxycarbonyl groups occurred during heating at 200 °C. The onset temperatures for the deprotection depended on the BHEA and HEA contents and their sequence structures because the hydroxy group in the side chain accelerated the deprotection via an autocatalytic reaction mechanism. Shear holding power and 180° peel tests were carried out with the pressure-sensitive adhesive tapes using the BHEA-containing copolymers as the adhesive materials. The copolymers consisting of the BHEA, 2EHA, and HEA units with 25.7, 35.0, and 39.3 mol %, respectively, exhibited the highest adhesion strength and the subsequent quick reduction of the adhesion strength by heating during the dismantling process. The addition of hexamethylene diisocyanate as the cross-linker and Zn(acac) 2 as the Lewis acid to the adhesive polymers was demonstrated to be valid for the design of high-performance dismantlable adhesion systems. A change in the rheological properties during the dismantling process was important for a quick response and selective interfacial failure between the substrate and the adhesive.
We have developed the photocrosslinked films of a diphenyl-or dinaphthylfluorene having epoxy and oxetane moieties and polysilanes blends in the presence of a photoacid generator by irradiation at 405 nm.Photo-induced decomposition of the Si-Si bonds of the polysilanes was successfully suppressed during the visible light irradiation. The cationic photocrosslinking properties of the blends were strongly affected by the post-exposure-bake conditions and irradiation dose.Polysilane moieties were incorporated into the film by the termination reaction of the polymerization with the terminal OH groups. We have successfully fabricated films with high refractive indices (nd: 1.70) and the refractive index values were tunable by irradiation at 254 nm due to the decomposition of the Si-Si bonds of the polysilanes.
Various types of polymers containing tert‐butoxycarbonyl (BOC) moiety as the typical protecting group of functional moieties have been used for the design of stimuli‐responsive polymer materials. In this study, we investigated the heat‐responsive deprotection behavior of BOC‐containing polymers obtained by radical polymerization of 4‐(tert‐butoxycarbonyloxy)styrene (BSt) and copolymerizations of BSt with styrene and methyl acrylate. The deprotection of BOC groups accompanying the evolution of isobutene and carbon dioxide as gaseous products was monitored by thermogravimetric analyses at different temperature circumstances; that is, on heating at a rate of 10 °C/min and under isothermal conditions at various temperatures. The deprotection resulted in a significant decrease in the transmittance of visible light due to the formation of a large number of gas bubbles, that is, foaming, in the polymer films when a heating temperature was close to the glass transition temperature of the used polymer. The potential of BOC‐containing polymers was also evaluated as the heat‐responsive adhesive polymers for dismantlable adhesion. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46252.
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