To improve the capabilities of excimer laser ablation processing apparatus, we have been developing an innovative Multiple Irradiation Optical System (Multiple Irradiator). In this system, we placed a reflector opposite the mask, and used a mask with a highly reflective coating. The laser beams therefore irradiate the mask repeatedly, and we can use the laser energy more efficiently than conventional optical systems.The experimental results show that our system is 12 times more energy efficient than the conventional optical systems.Also, we have made a prototype excimer laser material processing apparatus with the multiple irradiator, which is suitable for drilling viaholes of less than 100 tm diameters such as viaholes of print circuit boards. The processing speed is less than 1 minute when the material is 100 mmx 100mm wide and 25 tm thicknesses polyimide film, and the laser energy is 40 mJ/shot with 600Hz frequency.
In order to improve the capabilities of the exicimer laser ablation apparatus thatuses an imaging optical system, we have been developing an innovative multiple irradiation optical system, which utilizes laser energy more efficiently than a conventional optical system. In our system, a reflector is placed opposite the mask, and the mask surface is made of a highly reflective coating. In this optical system, a laser beam irradiates the mask repeatedly,and the laser energy is used more efficently than in the conventional optical system.Experimental' results show that, in comparison with the conventional optical system, our system is 12 times energy efficient.
In order to use the excimer laser ablation in the practical application of flexible printed circuit board production, a high-speed excimer laser micro-drilling apparatus has been developed. The apparatus has two significant technical points: (1) the increased energy efficiency of the optical system which is named Multiple Irradiation Optical System(MIOS), (2) the synchronous scanning system that enables large area processing. Newly developed MIOS with a spherical concave mirror is more stable than the MIOS with a flat mirror. The energy efficiency of the MIOS is high even for large mask openings. The apparatus has been applied for drilling of via-holes of the size less than 20 microns. The processing time is about one minute for a polyimid film 100mm X 100mm wide and 25 microns thick.
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