Thermolysis of gold(I) thiolate complex, [C14H29(CH3)3N][Au(SC12H25)2], at 180 degrees C for 5 h under an N2 atmosphere produces novel gold nanoparticles passivated by alkyl groups derived from the precursor complex, the TEM image of which shows spherical particles with average diameter 26 nm.
A low-temperature bonding process to form joints with high strength and ionic migration resistance using mixed Cu-Ag nanoparticles was studied. Although it was difficult to obtain strong joints using Cu nanoparticles, with the addition of Ag nanoparticles to the Cu nanoparticles the bonding strength of the Cu-to-Cu joints increased. The joints formed by the mixed Cu-Ag nanoparticles at 350°C exhibited a high bonding strength of $50 MPa. Counterelectrodes made of the mixed Cu-Ag nanoparticles had four times higher ionic migration resistance compared with counterelectrodes made only of Ag nanoparticles.
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