The plastic deformation of seven 5083 commercial aluminum materials, produced from five different alloy heats, are evaluated under conditions of interest for superplastic and quick-plastic forming. Two mechanisms are shown to govern plastic deformation in AA5083 over the strain rates, strains, and temperatures of interest for these forming technologies: grain-boundary-sliding (GBS) creep and solutedrag (SD) creep. Quantitative analysis of stress transients following rate changes clearly differentiates between GBS and SD creep and offers conclusive proof that SD creep dominates deformation at fast strain rates and low temperature. Furthermore, stress transients following strain-rate changes under SD creep are observed to decay exponentially with strain. A new graphical construction is proposed for the analysis and prediction of creep transients. This construction predicts the relative size of creep transients under SD creep from the relative size of changes in an applied strain rate or stress. This construction reveals the relative size of creep transients under SD creep to be independent of temperature; temperature dependence resides in the "steady-state" creep behavior to which transients are related.

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A modified AA5083 aluminum sheet material containing a Cu addition of 0.61 wt pct has been investigated under conditions relevant to commercial hot-forming technologies. This material was produced by continuous casting followed by industrial hot and cold rolling into sheet. Deformation and failure mechanisms at elevated temperatures were investigated through mechanical testing, thermal analysis, and microscopy. The effects of Cu addition are evaluated by comparisons with data from AA5083 sheet materials without Cu addition, produced both by continuous and direct-chill (DC) casting techniques. At low temperatures and fast strain rates, for which solute-drag (SD) creep governs deformation, the Cu addition slightly increases tensile ductility at 450°C but does not otherwise alter deformation behaviors. At high temperatures and slow strain rates, for which grainboundary-sliding (GBS) creep governs deformation, the Cu addition decreases flow stress and, at 450°C, improves tensile ductility. A strong temperature dependence for tensile ductility results from the Cu addition; tensile ductility at 500°C is notably reduced from that at 450°C. The Cu addition creates platelike particles at grain boundaries, which produce incipient melting and the observed mechanical behavior.

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