-In the past few decade, Additive Manufacturing (AM) has become popular and substantial to manufacture direct functional parts in varieties industrial applications even in very challenging like aerospace, medical and manufacturing sectors. Selective Laser Melting (SLM) is one of the most efficient technique in the additive Manufacturing (AM) which able to manufacture metal component directly from Computer Aided Design (CAD) file data. Accuracy, mechanical and physical properties are essentials requirement in order to meet the demand of those engineering components. In this paper, the mechanical properties of SLM manufactured AlSi10Mg samples such as hardness, tensile strength, and impact toughness are investigated andcompared to conventionallyhigh pressure die cast A360 alloy. The results exposed that the hardness and the yield strength of AlSi10Mg samples by SLM were increased by 42% and 31% respectively to those of conventionally high pressure die cast A360 alloy even though without comprehensive post processing methods. It is also discovered that AlSi10Mg parts fabricated by SLM achieved the highest density of 99.13% at the best setting parameters from a previous studyof 350 watts laser power, 1650 mm/s scanning speed and hatching distance 0.13 mm. Keywords-Additive Manufacturing; AlSi10Mg; Mechanical Properties; Selective Laser Melting I. INTRODUCTION Selective Laser Melting (SLM) is one of the best technique in the additive Manufacturing (AM) which able to produce metal component with a single step process by following the Computer Aided Design (CAD) file data. Contrasting by conventional subtractive machining methods, SLM produced parts by a layer construction process, whereas thin layers of material are deposited/solidified, intricately, stacked on top of another. The layer information originates from 2-D cross sections of a 3-D CAD model. The fabrication process replications continue from bottom to top until the product is completed [1]- [4]. With the development of SLM over the past decade, the demand of the complex and new customize products on the market can be complied and simultaneously reduced the production time and manufacturing costs. Furthermore, SLM techniques are categorized green manufacturing by recycling the powder material that leads to zero wastage within the processes.In the AMpowder bed technique as illustrated inFig. 1. The piston raisedthe powder dispenser platform within the range of the thickness layer that been specified and then the re-coater arm distributed a layer of powder on top of the powder bed.A laser beam then melts and fuse the layer of powder metal, referring to the generated slice. After fabricating a layer was completed, the build piston will lower down the build platform and the following layer of powder is spread. The fabrication process repetitions continue from bottom to top until the part is completed.The SLM process is controlled by the set of parameters demonstrated in Table I that has a great influence on the quality of the final part [5]. The foremos...

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An experimental analysis was included to study and investigate the mass transport behavior of cupric ions reduction as the main reaction in the presence of 0.5M H2SO4 by weight difference technique (WDT). The experiments were carried out by electrochemical cell with a rotating cylinder electrode as cathode. The impacts of different operating conditions on mass transfer coefficient were analyzed such as rotation speeds 100-500 rpm, electrolyte temperatures 30-60 , and cupric ions concentration 250-750 ppm. The order of copper reduction reaction was investigated and it shows a first order reaction behavior. The mass transfer coefficient for the described system was correlated with the aid of dimensionless groups as follows:   Sh = 3.77                               4075 <  Re  < 34088

Surface reconstruction of silicon using lasers could be utilized to produce silicon nanostructures of various features. Electrochemical and photoelectrochemical etching processes of silicon were employed to synthesize nanostructured surface. Effects of current densities 5, 10 and 20 mA/cm2 on the surface features were examined. It is found that the surface porosity and layer thickness increase with the current density. Moreover, large surface area of 410 m2/cm3 can be achieved when laser power density 0f 0.6 W/cm2 was used during the etching process. Optimum operating conditions were found to achieve better silicon nanostructured surface features. The surface roughness can be reduced to 8.3 nm using laser beam of 650 nm irradiated the silicon surface during the photoelectrochemical etching process. The surface morphology of the nanostructured silicon surface using SEM and AFM could give rich details about the surface. Silver nanoparticles of 10 – 20 nm was embedded at the nanostructured silicon surface by LIFT process to reduce the surface resistance and maintain the large surface area. This technique enables silicon nanostructures to be efficiently used in many optoelectronic applications.