Abstract-In this paper, the influence of Al particle size and the applied firing profile on void formation in local rear contacts of wafer-based silicon solar cells is investigated. Samples with a passivated emitter and rear cell (PERC) rear, but without front metallization, were metalized with six different Al screen-printing pastes, i.e., both commercial and homemade, featuring different particle size distributions and fired in a rapid thermal processing furnace with different firing profiles. Voids were detected with scanning acoustic microscopy measurements, and the fraction of voids in rear local contacts was analyzed. It was shown that the heating phase of the firing process has the strongest influence on void formation. With slower heating, void formation could be reduced to a fraction lower than 5% of the local contact area. Furthermore, it was shown that Al pastes consisting of a mixture of small and large Al particle sizes have a positive effect on the formation of voids.

Heat management at the nanoscale is an issue of increasing importance. In optoelectronic devices the transport and decay of plasmons contribute to the dissipation of heat. By comparison of experimental data and simulations we demonstrate that it is possible to gain quantitative information about excitation, propagation and decay of surface plasmon polaritons (SPPs) in a thin gold stripe supported by a silicon membrane. The temperature-dependent optical transmissivity of the membrane is used to determine the temperature distribution around the metal stripe with high spatial and temporal resolution. This method is complementary to techniques where the propagation of SPPs is monitored optically, and provides additional information which is not readily accessible by other means. In particular, we demonstrate that the thermal conductivity of the membrane can also be derived from our analysis. The results presented here show the high potential of this tool for heat management studies in nanoscale devices.