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Substantially more attention has been given in the past to shape memory alloys and shape memory ceramics than to shape memory polymers because unreinforced shape memory polymers have much lower stiffness and recovery force potential than shape memory alloys and shape memory ceramics. However, when incorporated into a fiber-reinforced composite, both the stiffness and the recovery force of a shape memory polymer can be dramatically improved. This paper presents recent advances in characterizing the shape memory mechanics of a thermoset shape memory polymer resin for Elastic Memory Composite (EMC) materials. In particular, heretofore undocumented response behavior is characterized through a series of thermo-mechanical tests of a commercially available EMC resin, and a lumped parameter model is adapted to accurately correlate this behavior. Through application of this model, it appears that the molecular transition associated with the shape memory effect occurs at a temperature other than the glass transition temperature of the resin.

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing this collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Department of Defense, Washington Headquarters Services, Directorate for Information PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) AND ADDRESS(ES) PERFORMING ORGANIZATION REPORT NUMBERComposite Technology Development, Inc 2600 Campus Drive Suite D Lafayette, CO 80026 SPONSORING / MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR'S ACRONYM(S) *Air Force Research LaboratorySpace Vehicles 3550 Aberdeen Ave SE SPONSOR/MONITOR'S REPORTKirtland AFB, NM 87117-5776 NUMBER(S) AFRL-VS-PS-TP-2006-1025 DISTRIBUTION / AVAILABILITY STATEMENTApproved for public release; distribution is unlimited. (Clearance #VS06-0130) SUPPLEMENTARY NOTESPublished in the 47 th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference Proceedings, 1 -4 May 2006, Newport, RI Government Purpose Rights ABSTRACTFuture small spacecraft will have a need for lightweight, highly reliable, and cost-effective mechanisms for the deployment of radiators, solar arrays, and other devices. To meet this need, Composite Technology Development, Inc. has developed TEMBO® Elastic Memory Composite (EMC) materials, which accommodate very high folding strains without damage, while providing very high deployed stiffness-and strength-to-weight ratios. Over the past few years, CTD has developed and performed extensive ground testing on a TEMBO® EMC deployment hinge for radiators, solar arrays and other deployable spacecraft components. The present paper will discuss the details of two flight experiments to validate the TEMBO® EMC hinge design on-orbit. In particular, the paper will discuss: 1) detailed design of the flight hardware for both experiments; 2) ground-verification and acceptance testing of the flight hardware; and 3) status of the flight missions. Future small spacecraft will have a need for lightweight, highly reliable, and costeffective mechanisms for the deployment of radiators, solar arrays, and other devices. To meet this need, Composite Technology Development, Inc. has developed TEMBO ® Elastic Memory Composite (EMC) materials, which accommodate very high folding strains without damage, while providing very high deployed stiffness-and strength-to-weight ratios. Over the past few years, CTD has developed and performed extensive ground testing on a TEMBO ® EMC deployment hinge for radiators, solar arrays and other deployable spacecraft components. The present paper will discuss the details of two flight experiments to validate the TEMBO ® EMC hinge design on-orbit. In particular, the paper will discuss: 1) detailed design of the flight hardware for both experiments; 2) ground-verificati...