No abstract

The initial stages of cobalt metal growth by atomic layer deposition are described using the precursors bis(1,4-di-tert-butyl-1,3-diazadienyl)cobalt and formic acid. Ruthenium, platinum, copper, Si(100), Si-H, SiO, and carbon-doped oxide substrates were used with a growth temperature of 180 °C. On platinum and copper, plots of thickness versus number of growth cycles were linear between 25 and 250 cycles, with growth rates of 0.98 Å/cycle. By contrast, growth on ruthenium showed a delay of up to 250 cycles before a normal growth rate was obtained. No films were observed after 25 and 50 cycles. Between 100 and 150 cycles, a rapid growth rate of ∼1.6 Å/cycle was observed, which suggests that a chemical vapor deposition-like growth occurs until the ruthenium surface is covered with ∼10 nm of cobalt metal. Atomic force microscopy showed smooth, continuous cobalt metal films on platinum after 150 cycles, with an rms surface roughness of 0.6 nm. Films grown on copper gave rms surface roughnesses of 1.1-2.4 nm after 150 cycles. Films grown on ruthenium, platinum, and copper showed resistivities of <20 μΩ cm after 250 cycles and had values close to those of the uncoated substrates at ≤150 cycles. X-ray photoelectron spectroscopy of films grown with 150 cycles on a platinum substrate showed surface oxidation of the cobalt, with cobalt metal underneath. Analogous analysis of a film grown with 150 cycles on a copper substrate showed cobalt oxide throughout the film. No film growth was observed after 1000 cycles on Si(100), Si-H, and carbon-doped oxide substrates. Growth on thermal SiO substrates gave ∼35 nm thick layers of cobalt(ii) formate after ≥500 cycles. Inherently selective deposition of cobalt on metallic substrates over Si(100), Si-H, and carbon-doped oxide was observed from 160 °C to 200 °C. Particle deposition occurred on carbon-doped oxide substrates at 220 °C.

The atomic layer deposition (ALD) of cobalt metal films is described using the precursor bis­(1,4-di-tert-butyl-1,3-diazadienyl)­cobalt and tert-butylamine or diethylamine. Platinum, copper, ruthenium, Si(100) with native oxide, thermal SiO2, hydrogen-terminated silicon, and carbon-doped oxide substrates were used with growth temperatures between 160 and 220 °C. Plots of growth rate versus pulse lengths showed saturative, self-limited behavior at ≥3.0 s for bis­(1,4-di-tert-butyl-1,3-diazadienyl)cobalt and ≥0.1 s for tert-butylamine. An ALD window was observed between 170 and 200 °C, with a growth rate of 0.98 Å/cycle on platinum substrates. A plot of thickness versus the number of cycles at 200 °C on platinum substrates was linear between 25 and 1000 cycles, with a growth rate of 0.98 Å/cycle. A 98 nm thick film grown at 200 °C showed crystalline cobalt metal by X-ray diffraction. Atomic force microscopy of 10 and 98 nm thick cobalt metal films grown on platinum substrates at 200 °C showed rms roughness values that were ≤3.1% of the film thicknesses. X-ray photoelectron spectroscopy analyses were performed on 49 and 98 nm thick films grown on platinum substrates at 170 and 200 °C, respectively. Both samples showed oxidized cobalt on the film surface but revealed cobalt metal upon argon ion sputtering. The films showed >98% pure cobalt, with ≤0.9% each of oxygen, carbon, and nitrogen. On copper substrates, a plot of thickness versus the number of cycles was linear between 25 and 500 cycles, with a growth rate of 0.98 Å/cycle. In contrast, analogous growth studies on ruthenium substrates showed no films after 25 and 50 cycles, a small amount of growth at 100 cycles, and a growth rate of 0.98 Å/cycle at 200 and 500 cycles. No film growth was observed at 200 °C on Si(100) with native oxide, 100 nm thermal SiO2, hydrogen-terminated silicon, and carbon-doped oxide substrates after 500 cycles. Similarly, no growth was observed on these insulating substrates after 200 cycles at temperatures between 160 and 220 °C. Accordingly, this process affords inherently selective cobalt metal growth on metal substrates between 160 and 220 °C. Lower purity nitrogen carrier and purge gas (<99.9%) afforded a much lower growth rate, likely because of the formation of surface cobalt oxides and attendant reduced cobalt metal nucleation. A mechanism for cobalt metal growth is proposed in which 1 and tert-butylamine form an adduct, which then decomposes thermally to cobalt metal, 1,4-di-tert-butyl-1,3-diazadiene, and tert-butylamine.

We report the growth of nickel metal films by atomic layer deposition (ALD) employing bis(1,4-di- tert-butyl-1,3-diazadienyl)nickel and tert-butylamine as the precursors. A range of metal and insulating substrates were explored. An initial deposition study was carried out on platinum substrates. Deposition temperatures ranged from 160 to 220 °C. Saturation plots demonstrated self-limited growth for both precursors, with a growth rate of 0.60 Å/cycle. A plot of growth rate versus substrate temperature showed an ALD window from 180 to 195 °C. Crystalline nickel metal was observed by X-ray diffraction for a 60 nm thick film deposited at 180 °C. Films with thicknesses of 18 and 60 nm grown at 180 °C showed low root mean square roughnesses (<2.5% of thicknesses) by atomic force microscopy. X-ray photoelectron spectroscopies of 18 and 60 nm thick films deposited on platinum at 180 °C revealed ionizations consistent with nickel metal after sputtering with argon ions. The nickel content in the films was >97%, with low levels of carbon, nitrogen, and oxygen. Films deposited on ruthenium substrates displayed lower growth rates than those observed on platinum substrates. On copper substrates, discontinuous island growth was observed at ≤1000 cycles. Film growth was not observed on insulating substrates under any conditions. The new nickel metal ALD procedure gives inherently selective deposition on ruthenium and platinum from 160 to 220 °C.

Owing to its narrow band gap and promising magnetic and photocatalytic properties, thin films of zinc ferrite (ZFO, ZnFe2O4) are appealing for fabrication of devices in magnetic recording media and photoelectrochemical cells. Herein we report for the first time the fabrication of photactive zinc ferrites via a solvent free, conventional CVD approach, and the resulting ZFO layers show promise as a photocatalyst in PEC water-splitting. For large scale applications, chemical vapor deposition (CVD) routes are appealing for thin film deposition; however, very little is known about ZFO synthesis following CVD processes. The challenge in precisely controlling the composition for multicomponent material systems, such as ZFO, via conventional thermal CVD is an issue that is caused mainly by the mismatch in thermal properties of the precursors. The approach of using two different classes of precursors for zinc and iron with a close match in thermal windows led to the formation of polycrystalline spinel type ZFO. Under the optimized process conditions, it was possible to fabricate solely ZFO in the desired phase. This work demonstrates the potential of employing CVD to obtain photoactive ternary material systems in the right composition. For the first time, the application of CVD grown ZFO films for photoelectrochemical applications is being demonstrated, showing a direct band gap of 2.3 eV and exhibiting activity for visible light driven photoelectrochemical water splitting.