This paper reports on a new DLC‐coated high speed steel tool for tapping into TiAl6V4. In analogy tests on a high‐temperature tribometer, a comparative analysis was carried out on coating systems containing carbon, nitrides and oxides with respect to their suitability for tapping into TiAl6V4. This comparative analysis revealed that DLC coatings were characterized by extremely low friction coefficients, low levels of wear and low material adhesion. Cutting tests using high speed steel taps coated with the DLC coating system CROMTIVIc2 confirm the outstanding tribological properties of this coating system. Compared to conventional TiCN‐coated taps, the new DLC‐coated tool expands the current application field to include higher cutting speeds and longer tool life. It therefore provides the opportunity for significantly increasing productivity when tapping into TiAl6V4.
Schott Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks in its advanced quality mask blank manufacturing line -ranging from Low Thermal Expansion Material (LTEM) high quality substrate polishing to low defect blank manufacturing. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to produce EUVL mask blanks meeting already some of the roadmap requirements. Further R&D is ongoing to path the way to the pilot production of EUV blanks which meet the beta-specifications end of 2005.We present the status of our EUVL substrate program and report on the recent results of our activities for low defect multilayer, buffer and absorber coating including new absorber materials. Recent results from the production of full LTEM EUV blanks with multilayer, buffer and absorber coatings will be presented. Process steps in the EUVL mask blank fabrication in a production environment were characterized in terms of defects; the process improvement potential is discussed. We will also throw a light on the aspects of changed layer properties after a longer period of storage.In addition, special metrology methods for EUVL components are currently being developed within the program. The status of the high throughput EUV-Reflectometer for mask blanks will be presented. We developed new processes to achieve EUVL requirements.
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