An integrated three-dimensional optical multilayer system for optical data communications is presented. It is based on the use of free-space optical light propagation and combines two integration principles, namely, planar and stacked integration. The combination of both integration schemes aims at a maximal design flexibility for complex geometric layouts. On the other hand, packaging issues that stem from assembly and tolerance have to be considered. Here we describe the basic concept and demonstrate the implementation of an optical interface module in a processor-memory bus.
The High-Speed Optoelectronic Memory Systems (HOLMS) project, sponsored by the European Union Information Society Technology program, aims to make the use of board level optical interconnection in information systems practical and economical by developing optoelectronic packaging technology compatible with standard electronic assembly processes. To demonstrate the potential of the technology, it develops a demonstrator system that addresses the most pressing problem of contemporary computer architecture: memory latency. This paper describes the key ideas and some preliminary results of the HOLMS projects focusing on the electronic interconnection technology, in particular optoelectronic packaging issues.
The high-speed optoelectronic memory system project is concerned with the reduction of latency within multiprocessor computer systems (a key problem) by the use of optoelectronics and associated packaging technologies. System demonstrators have been constructed to enable the evaluation of the technologies in terms of manufacturability. The system combines fiber, free space, and planar integrated optical waveguide technologies to augment the electronic memory and the processor components. Modeling and simulation techniques were developed toward the analysis and design of board-integrated waveguide transmission characteristics and optical interfacing. We describe the fabrication, assembly, and simulation of the major components within the system.
A one step functionalization of large surfaces and layers could be enabled by high power ultrashort pulsed lasers. Despite today's availability of high power ultrashort pulsed lasers (up to several hundred watts), it is still a challenge to structure large surface areas, which is required on embossing rollers, within an acceptable processing time for industrial roll-to-roll production. Furthermore, fluencies near the ablation threshold are necessary to provide the highest depth resolution with minor side effects. So, it is a challenge to convert the increasing high average laser power into a high processing speed by maintaining the well-known quality of ultrashort pulsed lasers constant. One approach is the combination of a high-speed application and several parallel ablating laser spots. In this contribution, a newly developed high compact picosecond laser with high pulse repetition rates and an average power of 500 W was distributed into 8 and 16 parallel beamlets by a diffractive optical element. The power was controlled by single acousto-optical modulators per beamlet. Different functional surface geometries have been realized on an embossing roller as a master, which is used for the replication of the structures in a roll-to-roll or a roll-to-plate process. Feature sizes from 2 μm to 10 μm in areas of 2 m2 could be processed. With this approach, functional structures such as reduction in friction, improved soft touch, or light guiding elements can be generated on large surfaces within short processing times.
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