Chemical resistance of electroless-deposited nickel–tin–phosphorus
(Ni–Sn–P) with a high Sn content (>30 at. %) and
Ni–P
layer on a cold-rolled commercial steel plate (SPCC) against a 5%
aq solution of sodium hypochlorite (NaClO aq), which was used as a
disinfectant solution, was examined. After immersion of Ni–Sn–P
and Ni–P layers at 25 °C for 72 h to NaClO aq, the surface
of the Ni–P layer showed a clearly corroded surface. On the
other hand, the Ni–Sn–P layers were not corroded, so
the Ni–Sn–P layers have chemical resistance properties
against NaClO aq. The importance of the Sn addition to Ni layers for
NaClO chemical resistance was confirmed. In addition, the chemical
resistance of the Ni–Sn–P layers against hydrogen sulfide
(H2S) gas and nitrogen acid (HNO3) vapor was
also determined.
This study examined chemical resistance of electroless-deposited nickel-tin-boron (Ni-Sn-B) , Ni-Sn-phosphorus (Ni-Sn-P) , and Ni-P layers on steel platecold-rolled commercial (SPCC) against an aqueous solution of sodium hypochlorite (NaClO) . Compared to the Ni-P layer, Ni-Sn-B and Ni-Sn-P layers exhibited higher chemical resistance against 0.2 g L -1 NaClO aqueous solution. After immersion of the Ni-P layer for 72 h to the NaClO aqueous solution, the Ni-P layer surface showed a clearly corroded surface. An image obtained using scanning electron microscopy revealed that the surface was dissolved and that it had nibbling patterns on its surface. However, surface corrosion was not observed in Ni-Sn-B and Ni-Sn-P layers. Results of compositional analysis with X-ray photoelectron spectroscopy indicate that B and P contained in the Ni-Sn-B and Ni-Sn-P layers were dissolved in the NaClO aqueous solution and that, from comparison of Ni/Sn atomic ratios before and after immersion of the Ni-Sn-B and Ni-Sn-P layers, Ni atoms were also dissolved in tiny amounts. The Ni-Sn-B, which had high Sn content, inhibited the dissolution of Ni from Ni-Sn surfaces.
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