A novel high temperature thermosetting resin system based on the addition polymerization of bis(4-maleimidopheny1)methaneand o,o'-diallyl-bisphenol A is presented in this paper. This system offers the temperature and toughness performance characteristics demanded for the fabrication of C-fibre laminates. The mechanism of the polyaddition reaction is unusual. In a first step an ENE addition reaction of the maleimide to the ally1 group occurs to give a 1:l adduct with a propenyl phenol type of structure. This is then followed by a Diels-Alder addition reaction of another maleimide functional group to the ENE adduct (by the so-called
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