IEEE 802.11 is the most popular wireless local area network (WLAN) standard in use. WLANs support broadband multimedia communication and hence providing quality of service requirements such as good throughput and minimum endto-end delay are the two main challenging issues in designing of WLAN protocols for supporting real-time applications. Until now, several Markov chain models have been developed to evaluate and to enhance the performance of the IEEE 802.11 distributed coordination function (DCF) protocol. However, these models cannot accurately predict the performance of the network. Also, the existing models suffer with high packet collisions resulting in degradation of throughput and end-to-end delay particularly under congested environments. This study proposes an exact Markov chain model to accurately predict the performance of the wireless networks. To alleviate the collisions and to avoid channel capture effect, the authors introduce a post-backoff stage to provide inter packet backoff (IPB) delay between successive packet transmissions. The analysis is carried out by considering the non-saturated traffic and the impact of channel errors because of Rayleigh fading. Results show significant improvement in throughput and reduction in delay using the proposed model when compared with the existing models.
In this work, the performance of copper (Cu), dielectric inserted horizontal graphene nanoribbon (Di-HGNR) interconnect, and dielectric inserted vertical graphene nanoribbon (DiVGNR) interconnects is investigated using active shielding and passive shielding techniques. However, the analysis is carried out by adapting driver-interconnect-load system. This analysis considers the interconnect length from 500 to 2000 µm for 10 nm technology node. Further, the crosstalk induced effects on various interconnect structures are examined. It is envisioned that Di-VGNR exhibits lowest propagation delay compared to Cu and Di-HGNR. Further, the in-phase and out-phase crosstalk delay among the coupled interconnect lines is determined. It is investigated that active shielded Di-VGNR has least crosstalk induced delay compared to other interconnect structures considered in this study. Therefore, Di-VGNR interconnects outperforms Cu and Di-HGNR and are best suited for future VLSI interconnects.
Booming VLSI technology has graciously facilitated down-scaling dimensions of on-chip devices and interconnects in integrated circuits (ICs) to nano-miniaturized scale. However, at nano-dimensions where added benefits of scaling are constrained by associated highly-dense on-chip nano-interconnect structures, their electro-migration effects and several limiting signal-integrity issues. These cumulatively affect the quality of signal (QoS) at output. Improving output QoS is essential for attaining faithful system performance. First, different structures and their performance of futuristic graphene based multi-layer graphene nano ribbon (MLGNR) interconnect is investigated. Then, to improve data rates and performance, efficient and novel carbon nanotube field effect transistors (CNTFETs) based ternary logic system is incorporated for the prominent nano-MLGNR interconnects. Then, QoS enhancement of highly potential DS-MLGNR interconnect is proposed using active shielding technique. Finally, is chase to further enrich QoS, adaptive least mean square (LMS) equalization technique is used at the receiver. The proposed work comprising of futuristic novel graphene interconnects with efficient ternary logic system together with adaption of several QoS improvement techniques are magnificent and panacea solution to limiting nano-interconnects in advanced ICs. Several interesting and seminal analyses such as delay, power, power-delay product, crosstalk, eye-diagram are performed that supports the novelty and effectiveness of the proposed work.
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