performance for the exposed die pad help dissipate heat from With the need for more functionality, smaller form factor chip to PCB directly when soldered to PCB. TFBGA is a kind and lower cost products in electronic industry, the various of substrate based package that solder balls accommodated structures of multi-chip 3D packages have become more and underneath substrate play the role of electrical path and heat more popular. Compared to single die package, the multiple dissipation. Solder balls, with ground signals, underneath die chips package can accommodate with multi-functional devices area can be regarded as thermal balls that can improve the . ..~~thermal performance of BGA type packages. Thermal and increase the memory capacity within same footprints as a yp pcg single die package. However, such high performance performance of package is evaluated in terms of its maximum structures also result in high power consumption, which junction temperature and the junction to ambient thermal becomes a primary challenge for heat management.resistance, OJA In this paper, we provide a thermal evaluation for multiple Three kinds of multi-chip packages were mounted on a chips packages wer considered fordifferentpac JEDEC size PCB as the test model and all the thermal test chips packages were considered for different package codtoso.iultosflo.EDC5 eiso structures, airflow rate, and PCB design by using condolons of smulatlions follow JEDEC 51 series of computational fluid dynamics (CFD) modeling technique. Methodology Firstly, different package structures like airflow There are three different package structures that mounted with rate and PCP size were evaluated. Next, different package structures mounted with external heat sink were evaluated. folurdiesnas shown inadFigumpAre1wre discussedFinNth pa per Finally the experiment was also conducted to confirm the incluedin NoPlead Bup ArQuad Flat package (E-pad LQFP) thermal performance of multi-chip NBA-QFN package with and Thin Fine pitch Ball Grid Array package (TFBGA). 2S2P PCB and had highly accuracy.Moreover, thermal performance for multiple chips packages with real application setting of external heat sink was also investigated. Finally, NBA-QFN package with multi-chip module thermal characteristic experiments was also conducted and had good agreement with simulation results.
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