Achieving a compound thin film with uniform thickness and high purity has always been a challenge in the applications concerning micro electro mechanical systems (MEMS). Controlling the adhesion force in micro/nanoscale is also critical. In the present study, a novel method for making a sputtering compound target is proposed for coating Ag–Au thin films with thicknesses of 120 and 500 nm on silicon substrates. The surface topography and adhesion forces of the samples were obtained using atomic force microscope (AFM). Rabinovich and Rumpf models were utilized to measure the adhesion force and compare the results with the obtained experimental values. It was found that the layer with a thickness of 500 nm has a lower adhesion force than the one with 120 nm thickness. The results further indicated that due to surface asperity radius, the adhesion achieved from the Rabinovich model was closer to the experimental values. This novel method for making a compound sputtering target has led to a lower adhesion force which can be useful for coating microgripper surfaces.
Adhesion is a critical factor in microelectromechanical systems (MEMSs) and is influenced by many parameters. In important fields, such as microassembly, an improved understanding of adhesion can result in higher precision. This study examines the influence of deposition of gold and titanium onto the atomic force microscope (AFM) tips in adhesion forces and Young’s modulus, between a few MEMS substrates (silicon, gold, and silver) and the AFM tips. It was found that, except for gold substrate, an AFM tip coated with gold has the highest adhesion force of 42.67 nN for silicon substrates, whereas the titanium-coated AFM tip decreases the force for all the samples. This study suggests that such changes must be taken into account while studying the adhesion force. The final results indicate that utilizing gold substrate with titanium AFM tip led to the lowest adhesion force, which could be useful in adhesion force measurement during microassembly.
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