In order to lower the cost of optical data link packaging, a new technology has been developed whch integrates optical and electrical components in a single, sealed, transfer molded package. This technology utilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment. A unique process, two step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly and IC package sealing. An injection molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics).The first applicanon of t h~s technology is a high performancc optical transcener package for the growmg FDDI market (125 MB/s) With a duplex MIC connector, this package conforms to an idustq standard outline and pmout The optical transceiver easil> inects full FDDI specifications The design mtegrates an LED, PIN, transmitter IC, recener IC and two capacitors in a smgle, overmoEded package The final assembly sequence was conceived using the latest Design For Simplicity (DFS) principles This paper describes the design concept and prototype model performance results [NIROUIJCTION Market projections indicate that the sales of optical data llnks will continue to grow significantly over the next few years This growth in the market has been sparked by significant reductions in price --allowing the technology to be extended to a wider range of applications in local arca networks. fiber to the desk and fiber to the home programs. 'To keep pace, the manufacturing technology for optical data links must migrate to one that can produce high volumes (hundreds of thousands) at a 'very low cost.One aspect of optical data link technology that is ripe with opportunities for cost reduction is packaging. First generation optical data links such as ATBiT's ODL@ 125 Transmitters & Receivers use die cast metal housings that are individually assembled with the optics and clectronics [I]. There is a large number of fixturing, clamping and adhesive curing steps. Many of these operations must be conducted serially on onc ODL at a time. Other optical data links such as AT&T's ODL 125 Series I I go one step further by packaging the integrated circuits (IC) in conventional DIP packages. The electronics and optics arc then individually assembled into an injection molded plastic frames [2]The package we describe in this paper is a high performance optical transceiver for the growing Fiber Distributed Data Interface (FDDI) market ( I 25 MB/s). With a duplex MIC connector, this package conforms to an industry standard outline and pinout. The design integrates active optical components (LED & PIN), tr,ansmitter and receiver ICs, and several passive components in a single, ovcrmolded package. The fully assembled package is shown in figure 1 BACKGROUND
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