International audienceTime-resolved interferometric microscopy was applied to investigate laser-induced blistering of a titanium film on a silica substrate. Ablation of the titanium/silica interface by single 0.7 ns pulses within a certain fluence range results in local exfoliation of the metal film from the substrate avoiding, however, complete film destruction. Time-dependent transformation of the metal surface profile was reconstructed from the interference patterns within 0-13 ns time delay range. Transverse annular waves with typical amplitude of one hundred of nanometers and estimated traveling speed of few kilometers per second were revealed on the blister surface. The wave occurrence was attributed to fast inhomogeneous bending of the film covering the expanding blister. The resultant high-frequency (similar to 1 GHz) vibrations of the metal surface provide intensive inertial forces when such metalized target is used for blister-based laser-induced forward transfer of nanopowders and organic molecules
The use of lasers in the processing of solar cell structures has been known for many years both for c-Si and thin-film solar technologies. The maturity of the laser technology, the increase in scale of solar module production and the pressures to drive down cost of ownership and increase cell efficiencies have all contributed to the adoption of laser processes in industrial manufacturing. Today laser systems are the tool of choice in thin-film module manufacturing both for scribing the cell interconnects and for the module edge isolation. For c-Si solar cells the primary laser application today is edge isolation and this is well-established in industrial production of most types of waferbased cells. Other laser processes are used in the production of advanced high-efficiency c-Si cell designs such as laser grooved buried contacts, emitter wrap-through or metal wrap-through interconnects, selective emitters and laser fired contacts. In the mission of the solar industry to reduce the cost of electricity generation there are increasing opportunities for laser processing to contribute to the goal of low cost of ownership in industrial manufacturing through improved module efficiencies, higher throughput and reduced process costs.
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