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Abstract. The authors introduce some further research on the problem depicted in [1]. The transient model has been worked out to check how rapidly the temperature of the chip changes when the applied power changes abruptly This means searching for the answer: how the thermal resistance and the maximum temperature vary versus time. The simulations required using the 3-D thermal model of considered system that was used in numerical simulations and next, tested with commercial software, ANSYS 5.7 based on Finite Element Method (FEM) and additional calculations.

AcknowledgementsSpecial thanks to Prof. R. Sittig ad his team from Institute of Electrophysics of Technical University of Braunschweig for permanent support mn the measurements.Keywords cx thrmal design >>, cx efficiency)> Abstract The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels.The conducted measurements show that to meet both thenmal and mechanical demands; the structure can achieve thermal resistance of 0. 1K/W. overtake the heat flux of the order of 100 250W/cm2 [3] become the most popular solution in the field of power electronics applications. The most intricate such a solution, characterised by the extremely large LOB 2005 -Pn.Jcii 0.1 Supcl-r )olm Suu1aLes for lBowecr 1loLCiis LISIK Zhigi¢niw DEl Own5 -L)i--;c11i ISBSN :9(U1548tf-5 I,.I LOB 2005 -1)ecsdcii 0.4 Supcl-r )olm S$u,>e for lBowecr tEloamic LISIK Zhigi¢niw DEl Own5 -L)i--;c11i ISBSN :9(U1548tf-5 i,.4