Workstation performance is improving at a rapid pace led by improvements in VLSI technology and system architecture. In the near future this trend will be limited by packaging unless similar improvements are made in the way we package the chips in high performance workstations. One approach is to use a multichip module to contain the entire processor function. We have developed a thin f i i multichip module for workstation applications. The prototype module contains a RISC processor consisting of nine CMOS VLSI chips. The package also contains decoupling capacitors and has 684 I/O. The substrate consists of a thin film structure fabricated on a silicon wafer using a polyimide dielectric and aluminum metal. All fabrication was done in an existing CMOS manufacturing line. IBM's C4 (controlled collapse chip connection) flip chip bonding technique was used to connect the CMOS VLSI chips to the package. The silicon substrate was packaged non-hermetically and connected to the next level of package using very high density surface mount flex cables. A clip-on heatsink was attached to the finished module which allows for up to 30 watts of power dissipation in the airflow found in a typical workstation environment.
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