Breast cancer continues to be the major cause of cancer death among women. The high genetic heterogeneity and chemoresistant phenotypes of breast tumors require the search for new compounds to expand the options for the treatment of this disease. Kaurenoic acid (KA) is an ent-kaurane typediterpene with cytotoxic and genotoxic effects against gastric and cervical cancer cells. In the present study, we report the antiproliferative effects of KA in the breast tumoral cell line MCF-7 and the normal breast counterpart MCF-10 A. The longterm cytotoxic effects of KA were observed by the reduction of survival fraction at 50 and 100 μM. At these concentrations, the treatment with KA increased the extension of DNA damage followed by G1 cell cycle phase accumulation and induction of apoptosis in both cell lines. Taken together, the results contained herein support the promising antiproliferative effects of KA.
There has been an increasing focus on surface mount technology, and the miniaturization of electronic assemblies. However, wave soldering still remains an integral part of the Printed Circuit Board (PCB) assembly process. Hole fill is an important aspect in wave soldering. It is caused by the capillary action of molten alloys, as the PCB traverses across the molten wave. The advent of Pb-free materials has tightened the process windows for wave soldering. This is primarily because Pb-free alloys have higher melting points. One way to enhance hole filling action is to increase the operating temperatures of the molten wave. This step, however, could result in the disintegration of surface mount or through hole devices, board discoloration and warpage. Flux selection is an important process step for Pb-free wave soldering as it enhances hole-fill and cleans the soldering surface of the oxides prior to the PCB hitting the wave. It is critical to use the ‘optimal’ flux in Pb-free wave soldering processes. The objective of this study is to determine the ‘best’ flux for the Pb-free wave soldering of 2.16mm (0.085″) thick PCBs with Ni/Au surface finish. The Pb-free solder in this application is SAC387 (95.5%Sn, 3.8%Ag, and 0.7% Cu) with VOC-free no clean water based flux. Under different conveyor speeds, the experimentation evaluates the ‘best’ flux among three candidates. Complete (100%) inspection using X-ray laminography equipment detects the percentage of hole fill and other defects such as bridging, flux residue, and solder balling. The ‘best’ flux should have the least number of defects.
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