Diffusion processes on the contact areas of the metal-solder-semiconductor system are experimentally studied in this work. Diffusion coefficients, activation energies and pre-exponential factors in samples commutated with solders based on Pb-Sb are determined. It has been established that lead-based solder has a significantly higher inertness to thermoelectric materials. The nickel-phosphorus coating was coated with a nickel-phosphorus coating according to the method described for copper busbars. Thermocouple legs and tire blanks were tinned with Pb -Sb eutectic solder. After tinning, the branches of the thermocouples of 2 × 2 × 4 mm and 3 × 3 × 4 mm dimensions were cut by electric spark cutting and soldered together with the conductor grids. Experimental verification of the obtained results was carried out by manufacturing and testing a cooling thermopile at high temperatures in individual halfcells.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.