Three-dimensional InGaN/GaN nano-and microstructures with high aspect ratios and large active sidewall areas are still of great interest in the field of optoelectronics. However, when grown by metalorganic chemical vapor deposition (MOCVD), their optical performance can be negatively affected by gradients in thickness and peak emission wavelength along their sidewalls, which is still a key obstacle for using such structures in commercial products. In this work, we present a detailed study on the different mechanisms causing this gradient, as well as means to alleviate it. Gas-phase mass transport and surface diffusion are found to be the two main processes governing the shell growth, and the predominance of one process over the other is varying with the geometry of the 3D structures as well as the spacing between them. Consequently, variations in temperature, which mainly affect surface diffusion, will have a stronger impact on structures with small separation between them rather than larger ones. On the other hand, variations in pressure modify gas-phase diffusion, and thus, structures with a large spacing will be more strongly affected. A proper design of the dimensions of 3D architectures as well as the separation between them may improve the gradient along the sidewalls, but a tradeoff with the active area per wafer footprint is inevitable.
The commonly observed absorption around 265 nm in AlN is hampering the outcoupling efficiency of light‐emitting diodes (LEDs) emitting in the UV‐C regime. Carbon impurities in the nitrogen sublattice (CN) of AlN are believed to be the origin of this absorption. A specially tailored experiment using a combination of ion implantation of boron, carbon, and neon with subsequent high‐temperature annealing allows to separate the influence of intrinsic point defects and carbon impurities regarding this absorption. Herein, the presented results reveal the relevance of the intrinsic nitrogen‐vacancy defect VN. This is in contradiction to the established explanation based on CN defects as the defect causing the 265 nm absorption and will be crucial for further UV‐LED improvement. Finally, in this article, a new interpretation of the 265 nm absorption is introduced, which is corroborated by density functional theory (DFT) results from the past decade, which are reviewed and discussed based on the new findings.
Herein, carbon‐implanted high‐temperature annealed (HTA) AlN layers are analyzed and donor–acceptor pair (DAP) transitions probably between the two most abundant impurities, carbon and oxygen, are identified. Both are regarded as the main, hard‐to‐avoid impurities in crystal growth. Oxygen is believed to lead to absorption in the deep UV below a wavelength of 250 nm. In contrast, carbon is the most likely candidate to be responsible for a distinct absorption band around 265 nm. This interpretation has recently been challenged. In this study, carbon‐implanted and HTA AlN layers with ion fluences above 8.1 × 1015 cm−2 are analyzed using low‐temperature and time‐resolved cathodoluminescence spectroscopy. Due to the high concentration of oxygen inside the AlN, as a result of the HTA process, a DAP transition between a most likely carbon‐related acceptor and ON is observed. The measured temperature‐ and power‐dependent blueshift of the peak emission energy as well as the luminescence transients can be clearly explained by a continuous change from a DAP transition at low temperature to a free electron to acceptor transition with increasing temperature. The findings are supported by a configurational coordinate model that describes the measured behavior qualitatively.
High-temperature annealing (HTA) is one of the most promising techniques to produce high-quality, cost-efficient AlN templates for further epitaxial growth of AlGaN devices. Unfortunately, the yield of this process seems to be limited due to the restricting face-to-face configuration that is typically used, in which contaminations of the template surface can occur easily. A high yield is crucial for process transfer into industry. Indeed, templates that are annealed in open-face configuration suffer from surface degradation due to excessive AlN evaporation during the course of the annealing process. To highlight the physics that are restricting the open-face approach of the process, sublimation behavior of AlN at temperatures and atmospheres typically used in HTA processes has to be examined. In this study, we use the Knudsen effusion mass spectrometry technique to confirm the previously published results on equilibrium partial pressures of species above AlN. Based on the experimentally determined data and further AlN sublimation experiments, the apparent sublimation coefficient of AlN in N2 and Ar atmospheres at HTA process conditions can be derived. Despite N2 having a stabilizing effect on AlN during HTA, the still high decomposition rates of several hundred nanometers per hour can explain the excessive damage that is typically observed if AlN/sapphire templates are annealed in an open-face configuration. Finally, based on theoretical considerations, a strategy to reduce the sublimation of AlN during HTA in open-face configuration is suggested.
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