Highly stretchable and conductive fibers have been fabricated by dip-coating of a layer of liquid metal (eutectic gallium indium, EGaIn) on printed silicone elastomer filaments. This fabrication method exploits a nanolayer of oxide skin that rapidly forms on the surface of EGaIn when exposed to air. Through dip-coating, the sticky nature of the oxide skin leads to the formation of a thin EGaIn coating (∼5 μm thick) on the originally nonconductive filaments and renders these fibers excellent conductivity. Electrical characterization shows that the fiber resistance increases moderately as the fiber elongates but always maintains conductivity even when stretched by 800%. Besides this, these fibers possess good cyclic electrical stability with little degradation after hundreds of stretching cycles, which makes them an excellent candidate for stretchable conductors. We then demonstrate a highly stretchable LED circuit as well as a conductive stretchable net that extends the 1D fibers into a 2D configuration. These examples demonstrate potential applications for topologically complex stretchable electronics.
Rational design of artificial microstructured metamaterials with advanced mechanical and physical properties that are not accessible in nature materials is very important. Making use of node rotation and ligament bending deformation features of chiral materials, two types of innovative 3D chiral metamaterials are proposed, namely chiral- chiral- antichiral and chiral- antichiral- antichiral metamaterials. In-situ compression and uniaxial tensile tests are performed for studying the mechanical properties and deformation mechanisms of these two types of 3D chiral metamaterials. Novel deformation mechanisms along different directions are explored and analyzed, such as: uniform spatial rotation deformation, tensile-shearing directed (compression-shearing directed), tensile-expansion directed (compression-shrinkage directed) deformation mechanisms of 3D chiral metamaterials, and competitions between different types of deformation mechanisms are discussed. The proposed 3D chiral metamaterials represents a series of metamaterials with robust microstructures design feasibilities.
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