Helium ion microscopy is now a demonstrated practical technology that possesses the resolution and beam currents necessary to perform nanofabrication tasks, such as circuit edit applications. Due to helium's electrical properties and sample interaction characteristics relative to gallium, it is likely that the properties and deposition characteristics of beam induced deposited films will be different than those produced using gallium focused ion beam technology. However, there is at this date very little literature discussing the use of helium beams for beam induced chemistry or characterization of the resulting films. In this article, the authors present initial results regarding the deposition of platinum using a helium ion microscope and a gaseous organometallic precursor. Within this work a Carl Zeiss ORION™ helium ion microscope was used along with an OmniGIS unit to deposit platinum while exploring a variety of controllable parameters such as beam current, beam overlap, and size of deposition.

The recently developed helium ion microscope (HIM) is now capable of 0.35 nm secondary electron (SE) mode image resolution. When low-k dielectrics or copper interconnects in ultra large scale integrated circuits (ULSI) interconnect structures were imaged in this mode, it was found that unique pattern dimension and fidelity information at sub-nanometer resolution was available for the first time. This paper will discuss the helium ion microscope architecture and the SE imaging techniques that make the HIM observation method of particular value to the low-k dielectric and dual damascene copper interconnect technologies. #

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

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