The corrosion behaviors of Cu-7.42Sn-0.156P and Cu-5.78Sn-0.162P alloys in different solutions were investigated. The results show that the Cu-Sn-P alloy with higher Sn content exhibits better corrosion resistance. In the NaCl, NaHCO 3 , and NaCl+NaHCO 3 solutions, compared with Cu-5.78Sn-0.162P alloy, the corrosion current densities of Cu-7.42Sn-0.156P alloy are reduced by 25.2%, 36.9%, and 34.5%, and the polarization resistances are increased by 32.0%, 25.4%, and 29.9%. The Cu-Sn-P alloys have the best corrosion resistance in the NaHCO 3 solution, followed by the NaCl solution and the worst in the NaCl + NaHCO 3 solution. The increase of Sn is helpful to improve the density and spalling resistance of the corrosion film. There is a double-layer structure for the corrosion film of Cu-Sn-P alloy. For the alloys immersed in the NaCl solution and the NaCl+NaHCO 3 solutions, the corrosion films consisted of Cu 2 O, CuO, and SnO 2 . For the alloys immersed in the NaHCO 3 solution, the corrosion films are composed of Cu 2 O, CuO, SnO, and SnO 2 . The increase of Sn content in the alloy can increase the contents of Cu 2 O and SnO in the corrosion films.
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