No abstract

Articles you may be interested inCompressive-tensile deformation of nanocrystalline nickel at high pressure and temperature conditions Appl. Phys. Lett. 103, 043118 (2013); 10.1063/1.4816744 High-speed creep process mediated by rapid dislocation absorption in nanocrystalline Cu J. Appl. Phys. 111, 063506 (2012); 10.1063/1.3694005 Deformation mechanism transition caused by strain rate in a pulse electric brush-plated nanocrystalline Cu J. Appl. Phys. 104, 053505 (2008); 10.1063/1.2973200 Dominant inelastic mechanisms in FCC metallic thin films and lines AIP Conf.

No abstract

No abstract

The electrodeposited nanocrystalline ͑nc͒ Ni with an average grain size of 27 nm by the tensile-relaxation tests shows substantial increase in ductility up to 10.7%-11.8% at all tested strain rates ͑from 4.17ϫ 10 −5 to 4.17 s −1 ͒, which is evidently higher than those ͑6%-10%͒ attained in the routine continuous tensile tests; while the ductility of the compared coarse-grained ͑CG͒ Ni almost keep invariable under the same two kinds of tension mode. Additionally, the notable stress softening and the subsequently parabola of convergence increase in flow stress ͑i.e., new strain hardening behavior͒ upon reloading was only observed in nc Ni during the tensile-relaxation tests, which illuminates that nc Ni lacks a permanent dislocation network like that in CG Ni during deformation process.