Understanding fluid and interfacial properties in extended nanospace (10-1000 nm) is important for recent advances of nanofluidics. We studied properties of water confined in fused-silica nanochannels of 50-1500 nm sizes with two types of cross-section: (1) square channel of nanoscale width and depth, and (2) plate channel of microscale width and nanoscale depth. Viscosity and wetting property were simultaneously measured from capillary filling controlled by megapascal external pressure. The viscosity increased in extended nanospace, while the wetting property was almost constant. Especially, water in the square nanochannels had much higher viscosity than the plate channel, which can be explained considering loosely coupled water molecules by hydrogen bond on the surface within 24 nm. This study suggests specificity of fluids two-dimensionally confined in extended nanoscale, in which the liquid is highly viscous by the specific water phase, while the wetting dynamics is governed by the well-known adsorbed water layer of several-molecules thickness.

Owing to the well-established nanochannel fabrication technology in 2D nanoscales with high resolution, reproducibility, and flexibility, glass is the leading, ideal, and unsubstitutable material for the fabrication of nanofluidic chips. However, high temperature (~1,000 °C) and a vacuum condition are usually required in the conventional fusion bonding process, unfortunately impeding the nanofluidic applications and even the development of the whole field of nanofluidics. We present a direct bonding of fused silica glass nanofluidic chips at low temperature, around 200 °C in ambient air, through a two-step plasma surface activation process which consists of an O(2) reactive ion etching plasma treatment followed by a nitrogen microwave radical activation. The low-temperature bonded glass nanofluidic chips not only had high bonding strength but also could work continuously without leakage during liquid introduction driven by air pressure even at 450 kPa, a very high pressure which can meet the requirements of most nanofluidic operations. Owing to the mild conditions required in the bonding process, the method has the potential to allow the integration of a range of functional elements into nanofluidic chips during manufacture, which is nearly impossible in the conventional high-temperature fusion bonding process. Therefore, we believe that the developed low-temperature bonding would be very useful and contribute to the field of nanofluidics.

A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (~1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ~25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O(2)/CF(4) gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.

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