A chemical technology for cleaning super-smooth surface, based on wet method, is put forward in order to solve the problems including that the dirt existing on the surface of optical components is difficult to remove, and the system used to estimate the surface quality is hard to establish. Firstly, in this paper, all kinds of dirt existing on optical surface and their adsorption mechanism are discussed. Secondly, a cleaning route has been designed. Thirdly, all the reagents in use are prepared and their decontamination capabilities are described. Finally, the cleaned optical components are tested. The result shows that the surface cleanliness is high, the defect density is no more than 0.7/mm 2 within a certain area, and the scattering loss is no more than 20ppm.
Firstly, in this paper, a reasonable process flow is designed and the surface roughness of each procedure is tested. Secondly, the influences of particle size distribution of slurry on the quality of super smooth surface are studied, and then the conclusions are obtained that large span distribution of slurry will lead to surface scratches. Lastly, the effects of aging and ratios of polishing pad on the quality of super smooth surface are researched, and then some specific process parameters are gained such as shaving cycle and asphalt ratios in different environments.
Ring polishing, also called continuous polishing, plays a very important role in the manufacturing of plane optical components with large aperture [1][2][3] . This paper theoretically analyses the problem of calculation and simulation of the uniformity of grinding removal in ring polishing. By using the MATLAB software, a series of simulation figures are given. Firstly, the relative motion path on the polishing lap of a point on the workpiece is obtained by programming.From the simulation results it could draw a conclusion that the motion path is complicated when rotating speed ratio is not equal to one. Thus, it's beneficial to the homogeneous material removal. Focus on the problem of the uniformity of grinding removal, then, this paper elaborates on the effect of material relative removal caused by factors such as rotating speed ratio and eccentricity theoretically [3] . When the size of the workpiece is large enough, it will be outside of the optical polishing pitch lap, and this paper will also discuss the material removal on the whole surface in this case. All the calculation and simulation will guide practice process.
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