Planarization of gap-filling materials for low-k dual damascene processes is getting more and more important due to the photoresist process window shrinking as the pitch and critical dimensions shrink. Defects, especially pattern collapses, will become a serious problem if there is no global planarization for low-k dual damascene processes. IC manufacturers and materials vendors have proposed several ways to improve the global planarization of gap filling, such as using materials with different viscosities, fine tuning gap-filling material coating recipes, and even using optical or chemical treatments to obtain global planarization. The effect of the different conformalities of the first and second coating materials on coating performance will be discussed.
Decreasing k1 factors require improved empirical models for the most critical challenge at 65nm node, contact holes especially. These requirements are reflected in the need for increasingly accurate lithography contour simulations. One of the major contributors to final OPC accuracy is the quality of the optical model. In this study, a new approach to the calibration of an optical model by using KIF will be proposed based upon the real through scanners and steppers of illumination distribution and implement to the OPC kernel.
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