SYNOPSISA dynamic torsional vibration method has been developed and used to investigate the isothermal cure processes of resin system of epoxy resin-boron trifluoride monoethylamine complex-Si02, optimizing its cure conditions and estimating the apparent dynamic parameters including gel time and rate of cure reaction and discussing the effect of filler on cure. The cure behavior of resin system has been predicted by the nonequilibrium thermodynamic theory. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method.
A dynamic torsional vibration method has been developed and used to investigate the isothermal cure processes of a thermosetting resin containing fillers. The isothermal cure behaviour of an epoxy resin-imidazole-SiO2 system at various temperatures and various SiO 2 filler Ioadings was predicted using non-equilibrium thermodynamic fluctuation theory. There was good agreement between the theoretical prediction and experimental curing curves. It has been shown that activation energy of the cure reaction remained almost a constant value of AH = 76.6 x 103 J mo1-1 within the range 0 to 120phr SiO2 filler Ioadings, but SiO2 filler has a complicated effect on the rate of the cure reaction.
The electrical conductivity of single crystals of the bis(p‐toluene sulfonate) of 2,4‐hexadiyne‐1,6‐diol (TS) and its polymer (PTS) was measured in a temperature range 77–373 K (to 353 K for TS), dielectric properties were measured from 123 to 283 K. Anomalies of the conductivity and the real part of the complex dielectric permittivity of TS and PTS along the molecular stacking direction at the temperature corresponding to the low‐temperature phase transitions were observed. The dependence of phase transitions on the polymerization conversion of the monomer TS was examined. The phase diagram of the TS‐PTS mixed system was constructed.
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