A suitable
conductive ink for office inkjet printers is important
for the convenient design of flexible electrodes for triboelectric
nanogenerators (TENG). Ag nanowires (Ag NWs) easily printed with an
average short length of 1.65 μm were synthesized by using soluble
NaCl as a growth regulator and adjusting the amount of chloride ion.
The water-based Ag NWs ink with a low solid content of 1% but with
low resistivity was produced. The printed flexible Ag NWs-based electrodes/circuits
showed excellent conductivity with R
S/R
0 values kept at 1.03 after bending 50,000 times
on PI substrate and an excellent anticlimate property in acidic conditions
for 180 h on polyester woven fabric. The sheet resistance was reduced
to 4.98 Ω/sqr heated at 30–50 °C for 3 min by a
blower due to the formed excellent conductive network when compared
to Ag NPs-based electrodes. Finally, the integration of printed Ag
NWs electrode and circuits was applied to the TENG, which can be used
to predict a robot’s out-of-balance direction by the change
of the TENG signal. In all, a suitable conductive ink with a short
length of Ag NWs was fabricated, and flexible electrodes/circuits
can be conveniently and easily printed by office inkjet printers.
Aiming to investigate the role and mechanism of nano MgO on the hot compressive deformation behavior of Mg alloys, the Mg-3Zn-0.2Ca alloy (MZC, in wt%) and the 0.2MgO/Mg-3Zn-0.2Ca alloy (MZCM, in wt%) were investigated systematically in the temperature range of 523–673 K and the strain rate range of 0.001–1 s−1. MZCM shows finer grains and second phase because of the refinement effects of added MgO. Flow behavior analysis shows that the addition of nano MgO promotes the dynamic recrystallization (DRX) of MZC. The flow stress of MZCM is lower than that of MZC during deformation at 523–623 K but exhibits a reverse trend at 673 K and 0.1–1 s−1. The constitutive analysis indicates that dislocation climb is the dominant deformation mechanism for MZC and MZCM. The addition of nano MgO particles decreases the stress sensitivity and deformation resistance for thermal deformation and improves the plasticity of the MZC. Besides, according to the processing map constructed at strains of 0.7 and corresponding microstructure evolution, MZCM exhibits higher power dissipation efficiency and smaller instability regions than MZC, and the optimum hot working condition for MZCM was determined to be at 623–653 K and 0.01–0.001 s−1.
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