Social media has become an increasingly prevalent fixture in youths' lives, with over 90% of teenagers reporting daily usage. These online sites and applications have provided many positive opportunities for youths to connect and share ideas with others; however, social media has also become a major platform for cyberbullying. Victims often experience negative health outcomes directly related to cyberbullying. For this reason, it is critical that third parties, such as school nurses, are well versed in social media and the warning signs of those being victimized by cyberbullying. Therefore, this integrative review examines school nurses' knowledge of cyberbullying and social media and identifies the implications for school nursing practice regarding prevention and intervention processes.
Over the past several years, researchers have postulated that Magnet® organizations improve collegiality and potentially could mitigate workplace bullying and lateral violence (BLV). In order to synthesize and evaluate the existing literature on BLV in the Magnet® setting, an integrative review was conducted. The final analysis consisted of 11 articles (8 quantitative and 3 qualitative studies) and revealed that researchers still use a variety of terms to define and measure BLV. Several of the studies used blended samples of both Magnet® and non-Magnet nurses, making it difficult to evaluate for response differences. The existing studies suggest that BLV continues to exist and remain a large issue even in the Magnet® setting (Hickson, 2013; Latham, Ringl, & Hogan, 2013). Future studies should examine the prevalence of BLV in both Magnet® and non-Magnet organizations and also explore the organizational factors that reduce its occurrence.
The following details a new test methodology offered as a cost effective alternative to module form-factor testing for detecting the delamination fail mode observed in Multiterminal low inductance capacitors (MTLICs) under temperature humidity bias (THB) reliability stress testing. This MTLIC test methodology yields the same delamination reliability failure-mode as observed in the module formfactor. We draw on this new testing methodology to highlight the influence of packaging materials, module form factor and component supplier on THB reliability performance of MTLIC components. BackgroundMTLICs are used throughout the electronics industry, on cards as well as microprocessor and ASICs modules. The interdigitated electrode configuration of a MTLIC capacitor offers enhanced electrical performance (low equivalent series inductance and resistance) in a low-cost compact component.The capacitance for a given component case-size and dielectric formulation is dictated by the electrode plate area, plate count, and dielectric thickness. The vectors for improved component electrical performance (increased capacitance) are opposite those for component reliability. i.e. increasing layer count or plate area, or decreasing dielectric thickness, when taken to the extreme, would be expected to detract from component reliability. To be competitive, component suppliers have to balance between advancing component performance and meeting component reliability objectives, as dielectric thickness and plate counts are taken to their limits. At the 59th Electronic Components & Technology Conference in 2009, IBM disclosed a new failure-mode observed in MTLIC components on FC-PBGA microprocessors and ASIC's modules.[1] IBM reported observations of MTLIC component delamination and insulation resistance failure at relatively short reliability stress test duration in standard 85C/85Rh/1.5-3V THB stress testing when performed in the module form-factor.These failures were observed in MTLIC part numbers that had successfully passed component supplier's qualification testing.The discrepancies between the component qualification results and IBM's on-module qualification data suggest a gap exists in the standard component qualification methodology. Component qualification testing doesn't necessarily ensure component reliability in the module formfactor.Sauter, et al. described a delamination failure mode IBM observed in MTLIC capacitors on organic modules exposed to temperature humidity bias (THB) stressing. The report describes the construction of the MTLIC capacitor, and
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