Motivated by the rapidly rising deployment of bifacial monocrystalline‐silicon photovoltaics (PV), we investigate the durability of various PV module packaging configurations with transparent coverings on both the front and rear sides of the module. We use a series of bifacial passivated emitter and rear cell (p‐PERC) mini‐modules with systematically varying outer cover materials (glass/glass, G/G, or glass/transparent backsheet, G/TB) and encapsulant chemistries (poly [ethylene‐co‐vinyl acetate], EVA; or polyolefin, POE). We study degradation modes over 1,000 hours of combined damp heat (DH) exposure and high system voltages that can cause potential‐induced degradation (PID) under positive, zero, or negative 1,000 V cell‐to‐frame bias. We analyze the degradation modes using a combination of current–voltage measurements, impedance spectroscopy, external quantum efficiency, and spatially resolved luminescence and thermal imaging. Our results highlight various types of degradation including shunting, enhanced recombination, and series resistance increases, and we use spatially resolved characterization to separately identify the localized effects. We show that multiple PID and moisture‐ingress degradation modes severely affect EVA‐containing modules, with previously reported PID processes under negative‐bias DH and a unique observation of rear‐side surface recombination in G/EVA/G modules under positive‐bias DH. We observe significantly less degradation in POE‐containing modules, where the G/POE/G configuration exhibits minimal degradation under all stress conditions that we employ.
In this paper, we demonstrated the plasticity mechanism for copper (Cu) extrusion in through-silicon via structures under thermal cycling. The local plasticity was directly observed by synchrotron x-ray micro-diffraction near the top of the via with the amount increasing with the peak temperature. The Cu extrusion was confirmed by Atomic Force Microscopy (AFM) measurements and found to be consistent with the observed Cu plasticity behavior. A simple analytical model elucidated the role of plasticity during thermal cycling, and finite element analyses were carried out to confirm the plasticity mechanism as well as the effect of the via/Si interface. The model predictions were able to account for the via extrusions observed in two types of experiments, with one representing a nearly free sliding interface and the other a strongly bonded interface. Interestingly, the AFM extrusion profiles seemed to contour with the local grain structures near the top of the via, suggesting that the grain structure not only affects the yield strength of the Cu and thus its plasticity but could also be important in controlling the pop-up behavior and the statistics for a large ensemble of vias.
Glass/glass (G/G) photovoltaic (PV) module construction is quickly rising in popularity due to increased demand for bifacial PV modules, with additional applications for thin-film and building-integrated PV technologies. G/G modules are expected to withstand harsh environmental conditions and extend the installed module lifespan to greater than 30 years compared to conventional glass/backsheet (G/B) modules. With the rapid growth of G/G deployment, understanding the outdoor performance, degradation, and reliability of this PV module construction becomes highly valuable. In this review, we present the history of G/G modules that have existed in the field for the past 20 years, their subsequent reliability issues under different climates, and methods for accelerated testing and characterization of both cells and packaging materials. We highlight some general trends of G/G modules, such as greater degradation when using poly(ethylene-co-vinyl acetate) encapsulants, causing the industry to move toward polyolefin-based encapsulants. Transparent backsheets have also been introduced as an alternative to the rear glass for decreasing the module weight and aiding the effusion of trapped gaseous degradation products in the laminate. New amendments to IEC 61215 standard protocols for G/G bifacial modules have also been proposed so that the rear side power generation and UV exposure will be standardized. We further summarize a suite of destructive and non-destructive characterization techniques, such as current–voltage scans, module electro-optical imaging, adhesion tests, nanoscale structural/chemical investigation, and forensic analysis, to provide deeper insights into the fundamental properties of the module materials degradation and how it can be monitored in the G/G construction. This will set the groundwork for future research and product development.
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