This study presents a method for the fabrication of solvent‐resistant poly(dimethylsiloxane) (PDMS) microfluidic devices by coating the microfluidic channel with a hybrid inorganic/organic polymer (HR4). This modification dramatically increases the resistance of PDMS microfluidic channels to various solvents, because it leads to a significant reduction in the rate of solvent absorption and consequent swelling. The compatibility of modified PDMS with a wide range of solvents is investigated by evaluating the swelling ratio measured through weight changes in a standard block. The HR4‐modified PDMS microfluidic device can be applied to the formation of water‐in‐oil (W/O) and oil‐in‐water (O/W) emulsions. The generation of organic solvent droplets with high monodispersity in the microfluidic device without swelling problems is demonstrated. The advantage of this proposed method is that it can be used to rapidly fabricate microfluidic devices using the bulk properties of PDMS, while also increasing their resistance to various organic solvents. This high compatibility with a variety of solvents of HR4‐modified PDMS can expand the application of microfluidic systems to many research fields.
Methacrylate octafunctionalized silsesquioxane (SSQMA) was shown to be an ideal material with high performance for ultraviolet (UV)-based nanoimprint lithography (NIL). The total viscosity of SSQMA-based formulations was adjusted to between 0.8 and 50 cP by incorporating low-viscosity acrylic additives, making the formulations suitable for UV-based NIL. The cured SSQMA-based formulations showed numerous desirable characteristics, including low volumetric shrinkage (4%), high Young's modulus (2.445-4.272 GPa), high resistance to oxygen plasma, high transparency to UV light, and high resistance to organic/aqueous media, as a functional imprint material for UV-based NIL and step-and-flash imprint lithography (SFIL). Using both techniques, the SSQMA-based formulations were easily transferred to relief structures with excellent imprint fidelity and minimal residual thickness. Formulations containing 50% SSQMA (wt %) were able to reproduce high-aspect-ratio nanostructures with aspect ratios as high as 4.5 using bilayer SFIL. Transparent rigiflex molds and hard replica molds with sub-50-nm size features were reproducibly duplicated by using UV-NIL with the SSQMA-based resin. Nanostructures with feature sizes down to 50 nm were successfully reproduced using these molds in both UV- and thermal-NIL processes. After repeating 20 imprinting cycles at relatively high temperature and pressure, no detectable collapse or contamination on the replica surface was observed. These properties of the SSQMA-based resins make them suitable as inexpensive and convenient components in all NIL processes that are based on physical contact.
The use of durable replica molds with high feature resolution has been proposed as an inexpensive and convenient route for manufacturing nanostructured materials. A simple and fast duplication method, involving the use of a master mold to create durable polymer replicas as imprinting molds, has been demonstrated using both UV- and thermal nanoimprinting lithography (NIL). To obtain a high-durability replicating material, a dual UV/thermal-curable, organic-inorganic hybrid resin was synthesized using a sol-gel-based combinatorial method. The cross-linked hybrid resin exhibited high transparency to UV light and resistance to organic solvents. Molds made of this material showed good mechanical properties (Young's modulus=1.76 GPa) and gas permeability. The low viscosity of the hybrid resin (approximately 29 cP) allowed it to be easily transferred to relief nanostructures on transparent glass substrates using UV-NIL at room temperature and low pressure (0.2 MPa) over a relatively short time (80 s). A low surface energy release agent was successfully coated onto the hybrid mold surface without destroying the imprinted nanostructures, even after O2 plasma treatment. Nanostructures with feature sizes down to 80 nm were successfully reproduced using these molds in both UV- and thermal-NIL processes. After repeating 10 imprinting cycles at relatively high temperature and pressure, no detectable collapse or contamination of the replica surface was observed. These results indicate that the hybrid molds could tolerate repeated UV- and thermal-NIL processes.
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