The use of a Si0.7Ge0.3 strained layer as an etch stop in silicon-based materials is reported. The etch rates were characterized through silicon and a 60 nm Si0.7Ge0.3 strained layer. The etch rate through undoped silicon was 17–20 nm/min, while the etch rate through the Si0.7Ge0.3 layer was 1 nm/min. After annealing the wafer to 850 °C for 30 min, transmission electron microscopy was used to show that strain in the alloy layer was only partially relieved, and that generated misfit dislocations were confined to the strained Si0.7Ge0.3 layer. The etch rate through the strained layer increased to 1.7 nm/min after this treatment, and was still perfectly functional as an etch stop.
The redistribution of recoil oxygen implants produced by the implantation of As ions through oxide layers on Si substrates has been investigated at annealing temperatures in the range 4000–1000 °C. Using transmission electron microscopy and secondary ion mass spectrometry profiling, it has been shown that the implanted (recoil) oxygen is rapidly gettered into residual damage structure at anneal temperatures < 900 °C. At temperatures ⩾ 1000 °C residual damage gettering sites are annihilated, releasing oxygen to migrate toward the Si surface. At the higher-annealing temperatures, oxygen has been shown to outdiffuse rapidly into the overlying (1000 Å) oxide layer on the sample surface.
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