An overview of the factors affecting the reliability of plastic-encapsulated ICs in moisture environments is presented. Particular attention is given to the moisture-related failure mechanism EMA (electrolytic metal attack). The package design and process steps and techniques developed at RCA (through identification of the proper analytical models, thorough engineering programs, and by the statistical design of experiments) are detailed. Particular attention was paid to eliminating chlorides and their sources. The nature and state of ongoing plastic-package moisture-resistance programmes and future expectations are described.
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