In-Memory-Computing (IMC) paradigm has been proposed as an alternative to overcome the memory wall faced by conventional von Neumann computing architectures. IMC architectures proposed today are built either from volatile or non-volatile basic memory cells, but a common feature is that all of them are prone to manufacturing defects in the same way as conventional memories. In this paper, we propose to analyze the behavior of an IMC 8T SRAM cell in presence of defects located in the read port of the cell. A model of a basic IMC memory array has been set up to simulate the behavior of the cell in the two modes of operation: memory mode and computing mode. Resistive short defects were injected into the read port and then analyzed. Preliminary results show that these defects can severely impact the behavior of the 8T SRAM in memory mode as well as computing mode. The final goal of this study is to develop effective test algorithms for these defects.
The adoption of In-Memory Computing (IMC) architectures is one of the promising approaches to efficiently solve the Von Neumann bottleneck problem. In addition to arithmetic operations, IMC architectures aim at integrating additional logic operations directly in the memory array or/and at the periphery for saving time and power consumption. In this paper, a comprehensive model of a 128x128 bitcell array based on a 28nm FD-SOI process technology has been considered to analyze the behavior of IMC 8T SRAM bitcells in the presence of resistive-open defects injected in the read port. A hierarchical analysis including a detailed study of each defect was performed in order to determine their impact both in memory and computing modes, both locally on the defective bitcell and globally on the array. Experimental results show that the IMC mode offers the most effective detectability of resistive-open defects.
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