In a previous work, magneto-rheological (MR) dampers were originally designed and implemented for reducing the vertical low-frequency vibration occurring in precise semi-conductor manufacturing equipment. To reduce the vibrations, an isolator levitated the manufacturing machine from the floor using pneumatic pressure which cut off the external vibration, while the MR damper was used to decrease the transient response of the isolator. However, it has been found that the MR damper also provides a damping effect on the lateral vibration induced by the high-speed plane motions. Therefore, in this work both vertical and lateral vibrations are controlled using the yield and shear stresses of the lateral directions generated from the MR fluids by applying a magnetic field. After deriving a vibration control model, an overall control logic is formulated considering both vertical and lateral vibrations. In this control strategy, a feedback loop associated with the laser sensor is used for vertical vibration control, while a feed-forward loop with the motion information is used for lateral vibration control. The experimental results show that the proposed concept is highly effective for lateral vibration control using the damping effect on multiple directions.
This work presents a novel signal processing method for high-speed 3D body measurements using millimeter waves with a general processing unit (GPU) and zero-padding fast Fourier transform (ZPFFT). The proposed measurement system consists of a radio-frequency (RF) antenna array for a penetrable measurement, a high-speed analog-to-digital converter (ADC) for significant data acquisition, and a general processing unit for fast signal processing. The RF waves of the transmitter and the receiver are converted to real and imaginary signals that are sampled by a high-speed ADC and synchronized with the kinematic positions of the scanner. Because the distance between the surface and the antenna is related to the peak frequency of the conjugate signals, a fast Fourier transform (FFT) is applied to the signal processing after the sampling. The sampling time is finite owing to a short scanning time, and the physical resolution needs to be increased; further, zero-padding is applied to interpolate the spectra of the sampled signals to consider a 1/m floating point frequency. The GPU and parallel algorithm are applied to accelerate the speed of the ZPFFT because of the large number of additional mathematical operations of the ZPFFT. 3D body images are finally obtained by spectrograms that are the arrangement of the ZPFFT in a 3D space.
A photoluminescence (PL) imaging method using a vision camera was employed to inspect InGaN/GaN quantum-well light-emitting diode (LED) epi-wafers. The PL image revealed dark spot defective regions (DSDRs) as well as a spatial map of integrated PL intensity of the epi-wafer. The Shockley-Read-Hall (SRH) nonradiative recombination coefficient increased with the size of the DSDRs. The high nonradiative recombination rates of the DSDRs resulted in degradation of the optical properties of the LED chips fabricated at the defective regions. Abnormal current-voltage characteristics with large forward leakages were also observed for LED chips with DSDRs, which could be due to parallel resistances bypassing the junction and/or tunneling through defects in the active region. It was found that the SRH nonradiative recombination process was dominant in the voltage range where the forward leakage by tunneling was observed. The results indicated that the DSDRs observed by PL imaging of LED epi-wafers were high density SRH nonradiative recombination centers which could affect the optical and electrical properties of the LED chips, and PL imaging can be an inspection method for evaluation of the epi-wafers and estimation of properties of the LED chips before fabrication.
Recent mechatronic systems, such as inspection machines or 3D imaging apparatuses, acquire and compute massive data for final results. A host in the mechatronic system is commonly composed of multiple hardware devices which interface with high-speed external signals. The host and the devices usually have large memory, so efficient data management is important due to data storage and transfer. In our software structure, each device is managed by respective application and large shared memory (LSM) is allocated in the host for the massive data. The shared memory is accessible from the device applications. Actions of the mechatronic system are driven by combining and broadcasting events through and inter-process communication (IPC). The model with LSM and IPC was applied to a 3D RF imaging system. We expect the proposed model can also be applied to machine vision with big image and engineering simulation with hardware accelerators.
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