With the increasing use of Computational Fluid Dynamics to investigate multiphase flow scenarios, modelling surface tension effects has been a topic of active research. A well known associated problem is the generation of spurious velocities (or currents), arising due to inaccuracies in calculations of the surface tension force. These spurious currents cause nonphysical flows which can adversely affect the predictive capability of these simulations. In this paper, we implement the Continuum Surface Force (CSF), Smoothed CSF and Sharp Surface Force (SSF) models in OpenFOAM. The models were validated for various multiphase flow scenarios for Capillary numbers of 10 − 3 –10. All the surface tension models provide reasonable agreement with benchmarking data for rising bubble simulations. Both CSF and SSF models successfully predicted the capillary rise between two parallel plates, but Smoothed CSF could not provide reliable results. The evolution of spurious current were studied for millimetre-sized stationary bubbles. The results shows that SSF and CSF models generate the least and most spurious currents, respectively. We also show that maximum time step, mesh resolution and the under-relaxation factor used in the simulations affect the magnitude of spurious currents.
A Helmholtz free energy description of the four nucleation mechanisms used to explain the bubble nucleation in electrochemical systems is presented. The mechanisms are compared based on the nucleation energy barrier and critical nuclei radius. The theoretical analysis sheds light on the effect of parameters like contact angle on the electrode surface and pre-existing gas bubbles on nucleation energy barrier. A free energy based description of surface tension (planar interface) is also obtained from the thermodynamic framework.
Purpose
The purpose of the paper is to develop a methodology to characterize the rheological behaviour of macroscopic non-Brownian suspensions, like solder paste, based on microstructural evolution.
Design/methodology/approach
A structure-based kinetics model, whose parameters are derived analytically based on assumptions valid for any macroscopic suspension, is developed to describe the rheological behaviour of a given fluid. The values of the parameters are then determined based on experiments conducted at a constant shear rate. The parameter values, obtained from the model, are then adjusted using an optimization algorithm using the mean deviation from experiments as the cost function to replicate the measured rheology. A commercially available solder paste is used as the test fluid for the proposed method.
Findings
The initial parameter values obtained through the analytical model indicates a structural breakdown that is much slower than observations. But optimizing the parameter values, especially the ones associated with the structural breakdown, replicates the thixotropic behaviour of the solder paste reasonably well, but it fails to capture the structure build-up during the three interval thixotropy test.
Research limitations/implications
The structural kinetics model tends to under-predict the structure build-up rate.
Practical implications
This study details a more realistic prediction of the rheological behaviour of macroscopic suspensions like solder paste, thermal interface materials and other functional materials. The proposed model can be used to characterize different solder pastes and other functional fluids based on the structure build-up and breakdown rates. The model can also be used as the viscosity definitions in numerical simulations instead of simpler models like Carreau–Yasuda and cross-viscosity models.
Originality/value
The rheological description of the solder paste is critical in determining its validity for a given application. The methodology described in the paper provides a better description of thixotropy without relying on the existing rheological measurements or the behaviour predicted by a standard power-law model. The proposed model can also provide transient viscosity predictions when shear rates vary in time.
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