Highly dense, negative temperature coefficient (NTC) thermistor thick films of NiMn2O4 were fabricated on glass substrate by aerosol deposition at room temperature. The nanocrystalline films thus obtained showed superior NTC figure characteristics with a B constant of over 3900 K without heat treatment. With increasing annealing temperature, the film resistivity was gradually decreased due to crystallization and grain growth, but the B constant was maintained over 3500 K.

Flexible thin films of Bi1.5Zn1.0Nb1.5O7 (BZN) were deposited on a Cu/polyimide (PI) foil by aerosol deposition at room temperature. The BZN film thickness was in the range of 1.2–17.9 μm. Highly dense and nanocrystalline films were obtained without any heat treatment. The dielectric constant and loss of the film at 100 kHz were over 150 and 0.04, respectively. Furthermore, the as‐deposited film showed markedly low leakage current densities of <10−9 A/cm2 at 3.0 V. These reasonably high dielectric properties were due to the nanocrystallinity of the films. The results confirm the significant potential of the BZN films as passive components in flexible printed circuit board applications.